SCDS339B January   2013  – April 2017 TS3A5223

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital Logic Translation
      2. 8.3.2 Break-Before-Make
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Low ON Resistance Switches
    • 0.45 Ω (Typical) at 3.6 V
    • 0.85 Ω (Typical) at 1.8 V
  • Wide Supply Range: 1.65 V to 3.6 V
  • 1.0 V Compatible Logic Interface
  • High Switch Bandwidth 80 MHz
  • 0.01% THD Across Entire Band
  • Specified min Break-before-make
  • Bi-directional Switching
  • –75 dB Channel-to-Channel Crosstalk
  • –70 dB Channel-to-Channel OFF Isolation of Very Low Power Dissipation and Leakage Currents
  • Very Small QFN-10 Package: 1.8 mm × 1.4 mm
  • ESD Protection on all Pins
    • 2 kV HBM, 500 V CDM

2 Applications

  • Portable Electronics
  • Smartphones, Tablets
  • Home Electronics
  • Wireline Communication

3 Description

The TS3A5223 is a high-speed 2-channel analog switch with break-before-make and bi-directional signal switching capability. The TS3A5223 can be used as a dual 2:1 multiplexer or a 1:2 dual de-multiplexer.

The TS3A5223 offers very low ON resistance, very low THD, channel-to-channel crosstalk and very high OFF isolation. These features make TS3A5223 suitable for application in Audio signal routing and switching applications.

The TS3A5223 control logic supports 1 V – 3.6 V CMOS logic levels. The logic interface allows direct interface with a wide range of CPUs and microcontrollers without increasing the current drawn from supply (ICC) and thus lowering power consumption.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TS3A5223 µQFN (10) 1.80 mm x 1.40 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Functional Diagram

TS3A5223 func_cds339.gif