SCDS324E August   2011  – Oct 2019 TS3DS10224

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Differential 1:4 or 2‑Channel 1:2 Configurations
    6. 6.6  Electrical Characteristics: Fan-Out 1:2 Configurations
    7. 6.7  Switching Characteristics: Differential 1:4 or 2‑Channel 1:2 Configurations
    8. 6.8  Switching Characteristics: Fan-Out 1:2 Configurations
    9. 6.9  Dynamic Characteristics: Differential 1:4 or 2‑Channel 1:2 Configurations
    10. 6.10 Dynamic Characteristics: Fan-Out 1:2 Configurations
    11. 6.11 Typical Characteristics
      1. 6.11.1 Single-Channel 1:4 or Dual-Channel 1:2 Configurations
      2. 6.11.2 Fan-Out 1:2 Configurations
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fail-Safe Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable
      2. 8.4.2 Differential Crosspoint Switch
      3. 8.4.3 2-Channel 1:2 Mux
      4. 8.4.4 1-Channel 1:4 Mux
      5. 8.4.5 Fan-Out 1:2 Configuration
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 1-Channel Differential 1:4 Mux
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 2-Channel Differential Crosspoint Switch
        1. 9.2.2.1 Design Requirements
      3. 9.2.3 Fan-Out Switch
        1. 9.2.3.1 Design Requirements
      4. 9.2.4 2-Channel Differential 1:2 SPDT Switch
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RUK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (May 2019) to E Revision

  • Changed mapping for OUTB0, and OUTB1 in Table 6Go

Changes from C Revision (November 2017) to D Revision

Changes from B Revision (December 2016) to C Revision

  • Changed columns OUTA1, OUTB0, and OUTB1 in Table 6Go

Changes from A Revision (May 2013) to B Revision

  • Added Device Information table, Pin Configuration and Functions section, Specifications section, ESD Ratings table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Added Thermal Information tableGo
  • Changed RθJA value From: 82.7 To: 45.2Go

Changes from * Revision (June 2011) to A Revision

  • Replaced 1 page preview with full documentGo