SCDS307D September   2010  – October 2022 TS3L501E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 1000 Base-T Ethernet Switching
    6. 6.6 Electrical Characteristics for 10/100 Base-T Ethernet Switching
    7. 6.7 Switching Characteristics
    8. 6.8 Dynamic Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Enable and Disable Times
    2. 7.2 Skew
    3. 7.3 HP8753ES Setup
    4. 7.4 HP8753ES Setup
    5. 7.5 HP8753ES Setup
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Electrical Characteristics for 10/100 Base-T Ethernet Switching

for 10/100 Base-T Ethernet switching over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V
(unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
VIK SEL, PD VDD = 3.6 V, IIN = –18 mA –0.7 –1.2 V
IIH SEL, PD VDD = 3.6 V, VIN = VDD ±2 μA
IIL SEL, PD VDD = 3.6 V, VIN = GND ±1 μA
IOFF SEL, PD VDD = 0 V, VIN = 0 to 3.6 V ±1 μA
ICC VDD = 3.6 V, II/O = 0, switch ON or OFF 250 600 μA
ICC_PD VDD = 3.6 V, VIN = 3.6 V, PD = high 1
CIN SEL, PD f = 1 MHz, VIN = 0 2.6 3.0 pF
COFF B or C port VI = 0,f = 10 MHz, outputs open, switch OFF 3 4 pF
CON VI = 0,f = 10 MHz, outputs open, switch ON 9 9.8 pF
ron VDD = 3 V, 1.25 V ≤ VI  ≤ VDD, IO = –10 mA to –30 mA 4 6 Ω
ron(flat) (3) VDD = 3 V, VI = 1.25 V and VDD, IO = –10 mA to –30 mA 0.5 Ω
Δron (4) VDD = 3 V, 1.25 V ≤ VI  ≤ VDD, IO = –10 mA to –30 mA 0.8 1.5 Ω
(1) VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs.
(2) All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°C.
(3) ron(flat) is the difference of ron in a given channel at specified voltages.
(4) Δron is the difference of ron from center (A4, A5) ports to any other port.