SCDS307D September 2010 – October 2022 TS3L501E
PRODUCTION DATA
THERMAL METRIC(1) | TS3L501E | UNIT | |
---|---|---|---|
RUA (WQFN) | |||
42 PINS | |||
RθJA | Junction-to-ambient thermal resistance(2) | 30.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 12.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 5.2 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.5 | °C/W |