SCDS277C
November 2008 – October 2024
TS3USB221A
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Dynamic Electrical Characteristics, VCC = 3.3V ±10%
5.7
Dynamic Electrical Characteristics, VCC = 2.5V ±10%
5.8
Switching Characteristics, VCC = 3.3V ±10%
5.9
Switching Characteristics, VCC = 2.5V ±10%
5.10
Typical Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Low Power Mode
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Receiving Notification of Documentation Updates
9.2
Support Resources
9.3
Trademarks
9.4
Electrostatic Discharge Caution
9.5
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RSE|10
MPQF186D
Thermal pad, mechanical data (Package|Pins)
Orderable Information
scds277c_oa
scds277c_pm
9.5
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.