SCDS277B November   2008  – July 2024 TS3USB221A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Dynamic Electrical Characteristics, VCC = 3.3V ±10%
    7. 5.7  Dynamic Electrical Characteristics, VCC = 2.5V ±10%
    8. 5.8  Switching Characteristics, VCC = 3.3V ±10%
    9. 5.9  Switching Characteristics, VCC = 2.5V ±10%
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Power Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted) (1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VIK Input-Source Clamp Voltage VCC = 3.6V, 2.7V, II = –18 mA –1.8 V
IIN Input leakage current, control inputs VCC = 3.6V, 2.7V, 0V, VIN = 0V to 3.6V ±1 μA
IOZ (3) Off-state leakage current VCC = 3.6V, 2.7V, VO = 0V to 5.25V, VI = 0V,
VIN = VCC or GND, Switch OFF		 ±1 μA
I(OFF) Power-off leakage current VCC = 0V VI/O = 0V to 5.25V ±2 μA
VI/O = 0V to 3.6V ±2
VI/O = 0V to 2.7V ±1
ICC Supply Current VCC = 3.6V, 2.7V, VIN = VCC or GND,
II/O = 0V, Switch ON or OFF		 30 μA
ICC Supply Current (low power mode) VCC = 3.6V, 2.7V, VIN = VCC or GND,
Switch disabled, OE in high state		 1 μA
ΔICC (4) Supply-current change, control inputs One input at 1.8V,
Other inputs at VCC or GND		 VCC = 3.6V 20 μA
VCC = 2.7V 0.5
Cin Input capacitance, control inputs VCC = 3.3V, 2.5V, VIN = VCC or 0V 1.5 2.5 pF
Cio(OFF) OFF capacitance VCC = 3.3V, 2.5V, VI/O = VCC or 0V, Switch OFF 3.5 5 pF
Cio(ON) ON capacitance VCC = 3.3V, 2.5V, VI/O = VCC or 0V, Switch ON 6 7.5 pF
RON (5) ON-state resistance VCC = 3V, 2.3V VI = 0V, IO = 30mA 3 6 Ω
VI = 2.4V, IO = –15mA 3.4 6
ΔRON ON-state resistance match between channels VCC = 3V, 2.3V VI = 0V, IO = 30mA 0.2 Ω
VI = 1.7, IO = –15mA 0.2
RON(flat) ON-state resistance flatness VCC = 3V, 2.3V VI = 0V, IO = 30mA 1 Ω
VI = 1.7, IO = –15mA 1
(1) VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
(2) All typical values are at VCC = 3.3V (unless otherwise noted), TA = 25°C.
(3) For I/O ports, the parameter IOZ includes the input leakage current.
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
(5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals.