SCDS348D September   2013  – August 2024 TS3USB3031

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Characteristics
    7. 5.7 Typical Characteristics
  7.   Parameter Measurement Information
  8. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 IOFF Protection
      2. 6.3.2 1.8-V Compatible Logic
      3. 6.3.3 Overvoltage Tolerant (OVT)
    4. 6.4 Device Functional Modes
  9. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
        1. 7.2.3.1 MHL Eye Pattern
        2. 7.2.3.2 USB EYE Pattern
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  11. Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Functional Modes

Table 6-1 lists the functional modes of the TS3USB3031.

Table 6-1 Function Table
SEL1SEL0SWITCH STATUS
LowLowD+/D– connected to USB1+/USB1–
LowHighD+/D– connected to USB2+/USB2–
HighLowD+/D– connected to MHL+/MHL–
HighHighUSB and MHL switches in High-Z