SCDS184F January   2005  – August 2018 TS5A2066

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics For 5-V Supply
    6. 6.6 Electrical Characteristics For 3.3-V Supply
    7. 6.7 Electrical Characteristics For 2.5-V Supply
    8. 6.8 Electrical Characteristics For 1.8-V Supply
    9. 6.9 Typical Performance
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCU|8
  • YZP|8
  • DCT|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2 Detailed Design Procedure

The TS5A2066 can be properly operated without any external components.

Unused signal path pins COM or NO maybe left floating or connected to ground through a 50-Ω resistor to prevent signal reflections back into the device.

TI recommends that the digital control pins (INX) be pulled up to VCC or down to GND to avoid undesired switch positions that could result from the floating pin. Leaving the logic pins floating may increase ICC. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004), for further details.