SCDS196J May   2005  – September 2019 TS5A23166

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: 5-V Supply
    6. 6.6  Electrical Characteristics: 3.3-V Supply
    7. 6.7  Electrical Characteristics: 2.5-V Supply
    8. 6.8  Electrical Characteristics: 1.8-V Supply
    9. 6.9  Switching Characteristics: 5-V Supply
    10. 6.10 Switching Characteristics: 3.3-V Supply
    11. 6.11 Switching Characteristics: 2.5-V Supply
    12. 6.12 Switching Characteristics: 1.8-V Supply
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TS5A23166 UNIT
DCU (VSSOP) YZP (DSBGA) YZT (DSBGA)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 212.2 99.9 99.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 77.6 1.0 1.4 °C/W
RθJB Junction-to-board thermal resistance 91.7 27.8 27.8 °C/W
φJT Junction-to-top characterization parameter 7.1 0.4 0.5 °C/W
φ JB Junction-to-board characterization parameter 91.1 27.8 27.7 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.