SCDS200F
June 2005 – January 2018
TS5A3159A
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Block Diagram
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics for 5-V Supply
6.6
Electrical Characteristics for 3.3-V Supply
6.7
Electrical Characteristics for 2.5-V Supply
6.8
Electrical Characteristics for 1.8-V Supply
6.9
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Device Support
12.1.1
Device Nomenclature
12.2
Documentation Support
12.2.1
Related Documentation
12.3
Community Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
YZP|6
MXBG347
DCK|6
MPDS114D
DBV|6
MPDS026P
Thermal pad, mechanical data (Package|Pins)
Orderable Information
scds200f_oa
scds200f_pm
6.4
Thermal Information
THERMAL METRIC
(1)
TS5A3159A
UNIT
DBV (SOT-23)
DCK (SC-70)
YZP (DSBGA)
6 PINS
6 PINS
6 PINS
R
θJA
Junction-to-ambient thermal resistance
165
259
123
°C/W
(1)
For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics
application report,
SPRA953
.