SCDS187C FEBRUARY   2005  – August 2018 TS5A3167

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simple Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics for 5-V Supply
    6. 6.6  Electrical Characteristics for 5-V Supply (continued)
    7. 6.7  Electrical Characteristics for 3.3-V Supply
    8. 6.8  Electrical Characteristics for 3.3-V Supply (continued)
    9. 6.9  Electrical Characteristics for 2.5-V Supply
    10. 6.10 Electrical Characteristics for 2.5-V Supply (continued)
    11. 6.11 Electrical Characteristics for 1.8-V Supply
    12. 6.12 Electrical Characteristics for 1.8-V Supply (continued)
    13. 6.13 Typical Performance
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Isolation in Powered-Off Mode, VCC = 0
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DCK|5
  • YZP|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (March 2017) to C Revision

  • Changed the DSBGA Body Size From: 1.50 mm x 9.00 mm To: 1.50 mm x 0.90 mm in the Device Information tableGo
  • Changed the YZP package pinout view From: Top View To: Bottom View Go

Changes from A Revision (October 2012) to B Revision

  • Added the Device Information table, Pin Configuration and Functions, ESD Ratings, Recommended Operating Conditions, Thermal Information, Detailed Description, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation SupportGo
  • Removed ORDERING INFORMATION tableGo

Changes from * Revision (February 2005) to A Revision

  • Updated ORDERING INFORMATION tableGo