SCDS385B January   2018  – July 2018 TS5MP645

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Powered-Off Protection
      2. 8.3.2 1.8 V Logic Compatible Inputs
      3. 8.3.3 Low Power Disable Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Functions
      2. 8.4.2 Low Power Mode
      3. 8.4.3 Switch Enabled Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFP|36
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

Place the supply de-coupling capacitors as close to the VDD and GND pin as possible. The spacing between the power traces, supply and ground, and the signal I/O lines, clock and data, should be a minimum of three times the race width of the signal I/O lines to maintain signal integrity.

The characteristic impedance of the trace(s) must match that of the receiver and transmitter to maintain signal integrity. Route the high-speed traces using a minimum amount of vias and corners. This will reduce the amount of impedance changes.

When it becomes necessary to make the traces turn 90°, use two 45° turns or an arc instead of making a single 90° turn.

Do not route high-speed traces near crystals, oscillators, external clock signals, switching regulators, mounting holes or magnetic devices.

Avoid stubs on the signal lines.

All I/O signal traces should be routed over a continuous ground plane with no interruptions. The minimum width from the edge of the trace to any break in the ground plane must be 3 times the trace width. When routing on PCB inner signal layers, the high speed traces should be between two ground planes and maintain characteristic impedance.

High speed signal traces must be length matched as much as possible to minimize skew between data and clock lines.