SLVSH43A July   2023  – January 2025 TSD05

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings—JEDEC Specification
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Tape and Reel Information
    2. 9.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DYF|2
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Typical Characteristics

TSD05 Positive TLP Curve
 
Figure 5-1 Positive TLP Curve
TSD05 Temperature vs Leakage Current
 
Figure 5-3 Temperature vs Leakage Current
TSD05 Bias Voltage vs Capacitance
 
Figure 5-5 Bias Voltage vs Capacitance
TSD05 Negative TLP Curve
 
Figure 5-2 Negative TLP Curve
TSD05 Temperature vs Capacitance
 
Figure 5-4 Temperature vs Capacitance