SLVSHX0 October   2024 TSD12C-Q1 , TSD15C-Q1 , TSD18C-Q1 , TSD24C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings - AEC Specifications
    3. 5.3  ESD Ratings—IEC Specification
    4. 5.4  ESD Ratings - ISO Specifications
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Thermal Information
    7. 5.7  Electrical Characteristics - TSD12C-Q1
    8. 5.8  Electrical Characteristics - TSD15C-Q1
    9. 5.9  Electrical Characteristics - TSD18C-Q1
    10. 5.10 Electrical Characteristics - TSD24C-Q1
    11. 5.11 Electrical Characteristics - TSD36C-Q1
    12. 5.12 Typical Characteristics
  7. 6 Application and Implementation
  8. 7 Application Information
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions


TSD12C-Q1 TSD15C-Q1 TSD18C-Q1 TSD24C-Q1 TSD36C-Q1 DYF Package, 2-Pin SOD-323 (Top View)

Figure 4-1 DYF Package, 2-Pin SOD-323 (Top View)
Table 4-1 Pin Functions
PINTYPE(1)DESCRIPTION
NO.NAME
1IOI/OProtected Channel. If used as IO, connect pin 2 to ground
2IOI/OProtected Channel. If used as IO, connect pin 1 to ground
(1) I = input, O = output