SLVSHX0 October   2024 TSD12C-Q1 , TSD15C-Q1 , TSD18C-Q1 , TSD24C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings - AEC Specifications
    3. 5.3  ESD Ratings—IEC Specification
    4. 5.4  ESD Ratings - ISO Specifications
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Thermal Information
    7. 5.7  Electrical Characteristics - TSD12C-Q1
    8. 5.8  Electrical Characteristics - TSD15C-Q1
    9. 5.9  Electrical Characteristics - TSD18C-Q1
    10. 5.10 Electrical Characteristics - TSD24C-Q1
    11. 5.11 Electrical Characteristics - TSD36C-Q1
    12. 5.12 Typical Characteristics
  7. 6 Application and Implementation
  8. 7 Application Information
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Thermal Information

THERMAL METRIC TSD12C-Q1 / TSD15C-Q1 / TSD18C-Q1 TSD24C-Q1 / TSD36C-Q1 UNIT
DYF (SOD-323) DYF (SOD-323)
2 PINS 2 PINS
RθJA Junction-to-ambient thermal resistance 683.8 686.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 264.2 267.0 °C/W
RθJB Junction-to-board thermal resistance 559.0 560.5 °C/W
ΨJT Junction-to-top characterization parameter 89.9 91.4 °C/W
ΨJB Junction-to-board characterization parameter 544.8 546.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W