SLVSH42C June   2023  – October 2024 TSD05C , TSD12C , TSD15C , TSD18C , TSD24C , TSD36C

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings—JEDEC Specification
    3. 5.3  ESD Ratings—IEC Specification
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics - TSD05C
    7. 5.7  Electrical Characteristics - TSD12C
    8. 5.8  Electrical Characteristics - TSD15C
    9. 5.9  Electrical Characteristics - TSD18C
    10. 5.10 Electrical Characteristics - TSD24C
    11. 5.11 Electrical Characteristics - TSD36C
    12. 5.12 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information

THERMAL METRIC (1) TSD05C TSD12C / TSD15C / TSD18C TSD24C / TSD36C UNIT
DYF (SOD-323) DYF (SOD-323) DYF (SOD-323)
2 PINS 2 PINS 2 PINS
RθJA Junction-to-ambient thermal resistance 672.0 683.8 686.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 230.5 264.2 267.0 °C/W
RθJB Junction-to-board thermal resistance 541.4 559.0 560.5 °C/W
ΨJT Junction-to-top characterization parameter 64.4 89.9 91.4 °C/W
ΨJB Junction-to-board characterization parameter 527.5 544.8 546.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.