SNLS696C April   2021  – July 2024 TSER953

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Recommended Timing for the Serial Control Bus
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 CSI-2 Receiver
        1. 6.3.1.1 CSI-2 Receiver Operating Modes
        2. 6.3.1.2 CSI-2 Receiver High-Speed Mode
        3. 6.3.1.3 CSI-2 Protocol Layer
        4. 6.3.1.4 CSI-2 Short Packet
        5. 6.3.1.5 CSI-2 Long Packet
        6. 6.3.1.6 CSI-2 Errors and Detection
          1. 6.3.1.6.1 CSI-2 ECC Detection and Correction
          2. 6.3.1.6.2 CSI-2 Check Sum Detection
          3. 6.3.1.6.3 D-PHY Error Detection
          4. 6.3.1.6.4 CSI-2 Receiver Status
      2. 6.3.2 V3Link Forward Channel Transmitter
        1. 6.3.2.1 Frame Format
      3. 6.3.3 V3Link Back Channel Receiver
      4. 6.3.4 Serializer Status and Monitoring
        1. 6.3.4.1 Forward Channel Diagnostics
        2. 6.3.4.2 Back Channel Diagnostics
        3. 6.3.4.3 Voltage and Temperature Sensing
          1. 6.3.4.3.1 Programming Example
        4. 6.3.4.4 Built-In Self Test
      5. 6.3.5 FrameSync Operation
        1. 6.3.5.1 External FrameSync
        2. 6.3.5.2 Internally Generated FrameSync
      6. 6.3.6 GPIO Support
        1. 6.3.6.1 GPIO Status
        2. 6.3.6.2 GPIO Input Control
        3. 6.3.6.3 GPIO Output Control
        4. 6.3.6.4 Forward Channel GPIO
        5. 6.3.6.5 Back Channel GPIO
    4. 6.4 Device Functional Modes
      1. 6.4.1 Clocking Modes
        1. 6.4.1.1 Synchronous Mode
        2. 6.4.1.2 Non-Synchronous Clock Mode
        3. 6.4.1.3 Non-Synchronous Internal Mode
        4. 6.4.1.4 DVP Compatibility Mode
        5. 6.4.1.5 Configuring CLK_OUT
      2. 6.4.2 MODE
    5. 6.5 Programming
      1. 6.5.1 I2C Interface Configuration
        1. 6.5.1.1 CLK_OUT/IDX
          1. 6.5.1.1.1 IDX
      2. 6.5.2 I2C Interface Operation
      3. 6.5.3 I2C Timing
    6. 6.6 Pattern Generation
      1. 6.6.1 Reference Color Bar Pattern
      2. 6.6.2 Fixed Color Patterns
      3. 6.6.3 Packet Generator Programming
        1. 6.6.3.1 Determining Color Bar Size
      4. 6.6.4 Code Example for Pattern Generator
    7. 6.7 Register Maps
      1. 6.7.1 Main Registers
        1. 6.7.1.1  I2C Device ID Register
        2. 6.7.1.2  Reset
        3. 6.7.1.3  General Configuration
        4. 6.7.1.4  Forward Channel Mode Selection
        5. 6.7.1.5  BC_MODE_SELECT
        6. 6.7.1.6  PLL Clock Control
        7. 6.7.1.7  Clock Output Control 0
        8. 6.7.1.8  Clock Output Control 1
        9. 6.7.1.9  Back Channel Watchdog Control
        10. 6.7.1.10 I2C Control 1
        11. 6.7.1.11 I2C Control 2
        12. 6.7.1.12 SCL High Time
        13. 6.7.1.13 SCL Low Time
        14. 6.7.1.14 Local GPIO DATA
        15. 6.7.1.15 GPIO Input Control
        16. 6.7.1.16 DVP_CFG
        17. 6.7.1.17 DVP_DT
        18. 6.7.1.18 Force BIST Error
        19. 6.7.1.19 Remote BIST Control
        20. 6.7.1.20 Sensor Voltage Gain
        21. 6.7.1.21 Sensor Control 0
        22. 6.7.1.22 Sensor Control 1
        23. 6.7.1.23 Voltage Sensor 0 Thresholds
        24. 6.7.1.24 Voltage Sensor 1 Thresholds
        25. 6.7.1.25 Temperature Sensor Thresholds
        26. 6.7.1.26 CSI-2 Alarm Enable
        27. 6.7.1.27 Alarm Sense Enable
        28. 6.7.1.28 Back Channel Alarm Enable
        29. 6.7.1.29 CSI-2 Polarity Select
        30. 6.7.1.30 CSI-2 LP Mode Polarity
        31. 6.7.1.31 CSI-2 High-Speed RX Enable
        32. 6.7.1.32 CSI-2 Low Power Enable
        33. 6.7.1.33 CSI-2 Termination Enable
        34. 6.7.1.34 CSI-2 Packet Header Control
        35. 6.7.1.35 Back Channel Configuration
        36. 6.7.1.36 Datapath Control 1
        37. 6.7.1.37 Remote Partner Capabilities 1
        38. 6.7.1.38 Partner Deserializer ID
        39. 6.7.1.39 Target 0 ID
        40. 6.7.1.40 Target 1 ID
        41. 6.7.1.41 Target 2 ID
        42. 6.7.1.42 Target 3 ID
        43. 6.7.1.43 Target 4 ID
        44. 6.7.1.44 Target 5 ID
        45. 6.7.1.45 Target 6 ID
        46. 6.7.1.46 Target 7 ID
        47. 6.7.1.47 Target 0 Alias
        48. 6.7.1.48 Target 1 Alias
        49. 6.7.1.49 Target 2 Alias
        50. 6.7.1.50 Target 3 Alias
        51. 6.7.1.51 Target 4 Alias
        52. 6.7.1.52 Target 5 Alias
        53. 6.7.1.53 Target 6 Alias
        54. 6.7.1.54 Target 7 Alias
        55. 6.7.1.55 Back Channel Control
        56. 6.7.1.56 Revision ID
        57. 6.7.1.57 Device Status
        58. 6.7.1.58 General Status
        59. 6.7.1.59 GPIO Pin Status
        60. 6.7.1.60 BIST Error Count
        61. 6.7.1.61 CRC Error Count 1
        62. 6.7.1.62 CRC Error Count 2
        63. 6.7.1.63 Sensor Status
        64. 6.7.1.64 Sensor V0
        65. 6.7.1.65 Sensor V1
        66. 6.7.1.66 Sensor T
        67. 6.7.1.67 CSI-2 Error Count
        68. 6.7.1.68 CSI-2 Error Status
        69. 6.7.1.69 CSI-2 Errors Data Lanes 0 and 1
        70. 6.7.1.70 CSI-2 Errors Data Lanes 2 and 3
        71. 6.7.1.71 CSI-2 Errors Clock Lane
        72. 6.7.1.72 CSI-2 Packet Header Data
        73. 6.7.1.73 Packet Header Word Count 0
        74. 6.7.1.74 Packet Header Word Count 1
        75. 6.7.1.75 CSI-2 ECC
        76. 6.7.1.76 IND_ACC_CTL
        77. 6.7.1.77 IND_ACC_ADDR
        78. 6.7.1.78 IND_ACC_DATA
        79. 6.7.1.79 V3LINK_TX_ID0
        80. 6.7.1.80 V3LINK_TX_ID1
        81. 6.7.1.81 V3LINK_TX_ID2
        82. 6.7.1.82 V3LINK_TX_ID3
        83. 6.7.1.83 V3LINK_TX_ID4
        84. 6.7.1.84 V3LINK_TX_ID5
      2. 6.7.2 Indirect Access Registers
        1. 6.7.2.1 PATGEN Registers
        2. 6.7.2.2 V3Link TX Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power-over-Coax
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 CSI-2 Interface
        2. 7.2.2.2 V3Link Input / Output
        3. 7.2.2.3 Internal Regulator Bypassing
        4. 7.2.2.4 Loop Filter Decoupling
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power-Up Sequencing
        1. 7.3.1.1 System Initialization
          1. 7.3.1.1.1 Example Code for Temperature Ramp Initialization
      2. 7.3.2 Power Down (PDB)
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 CSI-2 Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman body model (HBM) ESD Classification Level 3A(1)All pins except Media Dependent Interface Pins±4000V
Media Dependent Interface
Pins
Charged-device model (CDM) ESD Classification Level C6±1500V
IEC 61000-4-2
RD = 330Ω, CS = 150pF		Contact Discharge
(DOUT+ and DOUT-)		±8000V
Air Discharge
(DOUT+ and DOUT-)		±18000V
ISO 10605
RD = 330Ω, CS = 150pF and 330pF
RD = 2kΩ, CS = 150pF and 330pF
Contact Discharge
(DOUT+ and DOUT-)		±8000V



Air Discharge
(DOUT+ and DOUT-)


±18000V
  1. HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.