SLVSHG9A October   2023  – October 2023 TSM24B

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings -JEDEC Specifications
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7Application and Implementation
    1. 7.1 Application Information
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBZ|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20220527-SS0I-Z586-C9WD-TZGSJZ0FDLRM-low.svgFigure 5-1 DBZ Package, 3-Pin SOT-23 (Top View)
Table 5-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
IO3I/OSurge and ESD protected IO
GND1, 2GConnect to ground. To achieve the rated performance, connect pin 1 and 2 together on the PCB as close to the device as possible.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground