SLVSH74B June   2023  – October 2023 TSM24CA-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings - AEC Specifications
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 ESD Ratings - ISO Specifications
    5. 6.5 Recommended Operating Conditions
    6. 6.6 Thermal Information
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  8. 7Application and Implementation
    1. 7.1 Application Information
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBZ|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Thermal Information

THERMAL METRIC(1) TSM24CA UNIT
DBZ (SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 203.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 104.1 °C/W
RθJB Junction-to-board thermal resistance 39.4 °C/W
ΨJT Junction-to-top characterization parameter 8.7 °C/W
ΨJB Junction-to-board characterization parameter 38.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.