SBOS878D July   2017  – October 2019 TSV911 , TSV912 , TSV914

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Low-Side Motor Control
      2.      Small-Signal Overshoot vs Load Capacitance
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: TSV911
    2.     Pin Functions: TSV912
    3.     Pin Functions: TSV914
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TSV911
    5. 7.5 Thermal Information: TSV912
    6. 7.6 Thermal Information: TSV914
    7. 7.7 Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 2.5 V to 5.5 V
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input
      2. 8.3.2 Rail-to-Rail Output
      3. 8.3.3 Packages with an Exposed Thermal Pad
      4. 8.3.4 Overload Recovery
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TSV91x family, which includes single-, dual-, and quad-channel operational amplifiers (op amps), is specifically designed for general-purpose applications. Featuring rail-to-rail input and output (RRIO) swings, wide bandwidth (8 MHz), and low offset voltage (0.3 mV, typical), this family is designed for a variety of applications that require a good balance between speed and power consumption. The op amps are unity-gain stable and feature an ultra-low input bias current, which enables the family to be used in applications with high-source impedances. The low input bias current allows the devices to be used for sensor interfaces, battery-supplied and portable applications, and active filtering.

The robust design of the TSV91x provides ease-of-use to the circuit designer. Features include a unity-gain stable, integrated RFI-EMI rejection filter, no phase reversal in overdrive condition, and high electrostatic discharge (ESD) protection (4-kV HBV).

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TSV911 SOT-23 (5) 1.60 mm × 2.90 mm
SC70 (5) 1.25 mm × 2.00 mm
TSV912 SOIC (8) 3.91 mm × 4.90 mm
WSON (8) 2.00 mm × 2.00 mm
SOT-23 (8) 1.60 mm × 2.90 mm
TSV914 SOIC (14) 8.65 mm × 3.91 mm
TSSOP (14) 4.40 mm × 5.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.