SBOS878D July   2017  – October 2019 TSV911 , TSV912 , TSV914

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Low-Side Motor Control
      2.      Small-Signal Overshoot vs Load Capacitance
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: TSV911
    2.     Pin Functions: TSV912
    3.     Pin Functions: TSV914
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TSV911
    5. 7.5 Thermal Information: TSV912
    6. 7.6 Thermal Information: TSV914
    7. 7.7 Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 2.5 V to 5.5 V
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input
      2. 8.3.2 Rail-to-Rail Output
      3. 8.3.3 Packages with an Exposed Thermal Pad
      4. 8.3.4 Overload Recovery
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2 Detailed Design Procedure

The transfer function of the circuit in Figure 35 is shown in Equation 1.

Equation 1. TSV911 TSV912 TSV914 EQ_2_SBOS701.gif

The load current (ILOAD) produces a voltage drop across the shunt resistor (RSHUNT). The load current is set from 0 A to 1 A. To keep the shunt voltage below 100 mV at maximum load current, the largest shunt resistor is defined using Equation 2.

Equation 2. TSV911 TSV912 TSV914 EQ_3_SBOS701.gif

Using Equation 2, RSHUNT is 100 mΩ. The voltage drop produced by ILOAD and RSHUNT is amplified by the TSV91x to produce an output voltage of approximately 0 V to 4.95 V. The gain required by the TSV91x to produce the necessary output voltage is calculated using Equation 3:

Equation 3. TSV911 TSV912 TSV914 EQ_4_SBOS701.gif

Using Equation 3, the required gain is calculated to be 49.5 V/V, which is set with resistors RF and RG. Equation 4 is used to size the resistors, RF and RG, to set the gain of the TSV91x to 49.5 V/V.

Equation 4. TSV911 TSV912 TSV914 EQ_5_SBOS701.gif

Selecting RF as 165 kΩ and RG as 3.4 kΩ provides a combination that equals roughly 49.5 V/V. Figure 36 shows the measured transfer function of the circuit shown in Figure 35.