SBOSA18C may   2020  – june 2023 TSV911A-Q1 , TSV912A-Q1 , TSV914A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TSV911A-Q1
    5. 7.5 Thermal Information: TSV912A-Q1
    6. 7.6 Thermal Information: TSV914A-Q1
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input
      2. 8.3.2 Rail-to-Rail Output
      3. 8.3.3 Overload Recovery
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Input and ESD Protection
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information: TSV911A-Q1

THERMAL METRIC(1) TSV911A-Q1 UNIT
DBV (SOT-23) DCK (SC70)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 232.5 246.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 131.0 157.5 °C/W
RθJB Junction-to-board thermal resistance 99.6 95.4 °C/W
ψJT Junction-to-top characterization parameter 66.5 68.8 °C/W
ψJB Junction-to-board characterization parameter 99.1 95.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.