SBOS878D July   2017  – October 2019 TSV911 , TSV912 , TSV914

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Low-Side Motor Control
      2.      Small-Signal Overshoot vs Load Capacitance
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: TSV911
    2.     Pin Functions: TSV912
    3.     Pin Functions: TSV914
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TSV911
    5. 7.5 Thermal Information: TSV912
    6. 7.6 Thermal Information: TSV914
    7. 7.7 Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 2.5 V to 5.5 V
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input
      2. 8.3.2 Rail-to-Rail Output
      3. 8.3.3 Packages with an Exposed Thermal Pad
      4. 8.3.4 Overload Recovery
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDF|8
  • DGK|8
  • PW|8
  • DSG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (January 2019) to D Revision

  • Added SOT-23 (8) (DDF) package information to data sheetGo

Changes from B Revision (April 2018) to C Revision

  • Deleted preview notations for TSV911IDBV Go
  • Added SC70 package information to Device Information tableGo
  • Deleted package preview notation from TSV911 DBV (SOT-23) package Go
  • Added DCK (SC70) package information to Device Comparison TableGo
  • Deleted TSV911 DBV (SOT-23) package preview notation from Pin Configuration and Functions sectionGo
  • Added TSV911 DCK (SC70) package drawing and pin functions Go
  • Added TSV911 DBV and DCK package thermal informationGo

Changes from A Revision (October 2017) to B Revision

  • Changed TSV914 14-pin TSSOP package from preview to production data in Device Information tableGo
  • Deleted package preview note from 8-pin WSON package in Device Information table Go
  • Deleted package preview note from PW (TSSOP) package from Device Comparison table Go
  • Deleted package preview note from DSG (WSON) package from Device Comparison tableGo
  • Deleted package preview note from TSV912 DSG package pinout drawing in Pin Configuration and Functions sectionGo
  • Added DGK (VSSOP) thermal information to Thermal Information: TSV912 table Go
  • Deleted package preview note to TSV914 PW (TSSOP) package Thermal Information tableGo
  • Added PW (TSSOP) package information to Thermal Information: TSV914 tableGo
  • Changed TSV914 PW (TSSOP) junction-to-ambient thermal resistance from 135.8°C/W to 205.8°C/WGo
  • Changed TSV914 PW (TSSOP) junction-to-case(top) thermal resistance from 64°C/W to 106.7°C/WGo
  • Changed TSV914 PW (TSSOP) junction-to-board thermal resistance from 79°C/W to 133.9°C/WGo
  • Changed TSV914 PW (TSSOP) junction-to-top characterization parameter from 15.7°C/W to 34.4°C/WGo
  • Changed TSV914 PW (TSSOP) junction-to-board characterization parameter from 78.4°C/W to 132.6°C/WGo

Changes from * Revision (July 2017) to A Revision

  • Changed TSV914 14-pin SOIC package from preview to production data in Device Information tableGo
  • Deleted TSV911 SC70, SOT-553 and SOIC packages from Device Information table Go
  • Deleted TSV912 VSSOP packages from Device Information table Go
  • Deleted TSV911 SC70 and SOIC packages from pinout drawings and Pin Functions tableGo
  • Deleted TSV912 DGK and DGS packages from pinout images Pin Functions tableGo
  • Deleted package preview note from TSV914 pinout drawing and Pin Functions table Go
  • Added TSV914 Thermal Information table Go
  • Added 2017 copyright notice to Figure 35Go