SLLSF47D February   2018  – April 2024 TUSB1044

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 USB 3.1
      2. 6.3.2 DisplayPort
      3. 6.3.3 4-Level Inputs
      4. 6.3.4 Receiver Linear Equalization
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Configuration in GPIO mode
      2. 6.4.2 Device Configuration in I2C Mode
      3. 6.4.3 DisplayPort Mode
      4. 6.4.4 Custom Alternate Mode
      5. 6.4.5 Linear EQ Configuration
      6. 6.4.6 Adjustable VOD Linear Range and DC Gain
      7. 6.4.7 USB3.1 Modes
    5. 6.5 Programming
      1. 6.5.1 Use The Following Procedure to Write to TUSB1044 I2C Registers:
      2. 6.5.2 Use The Following Procedure to Read the TUSB1044 I2C Registers:
      3. 6.5.3 Use The Following Procedure for Setting a Starting Sub-Address for I2C Reads:
    6. 6.6 Register Maps
      1. 6.6.1 TUSB1044 Registers
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 System Examples
      1. 7.3.1 USB 3.1 only (USB/DP Alternate Mode)
      2. 7.3.2 USB3.1 and 2 lanes of DisplayPort
      3. 7.3.3 DisplayPort Only
      4. 7.3.4 USB 3.1 only (USB/Custom Alternate Mode)
      5. 7.3.5 USB3.1 and 1 Lane of Custom Alt Mode
      6. 7.3.6 USB3.1 and 2 Lane of Custom Alt Mode
      7. 7.3.7 USB3.1 and 4 Lane of Custom Alt Mode
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)±5000V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)±1500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.