SLLSEL4A September   2014  – October 2014 TUSB1210-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Analog I/O Electrical Characteristics
    6. 6.6  Digital I/O Electrical Characteristics
    7. 6.7  Digital IO Pins (Non-ULPI)
    8. 6.8  PHY Electrical Characteristics
    9. 6.9  Pullup/Pulldown Resistors
    10. 6.10 OTG Electrical Characteristics
    11. 6.11 Power Characteristics
    12. 6.12 Switching Characteristics
    13. 6.13 Timing Requirements
      1. 6.13.1 Timing Parameter Definitions
      2. 6.13.2 Interface Target Frequencies
    14. 6.14 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Processor Subsystem
        1. 7.3.1.1 Clock Specifications
          1. 7.3.1.1.1 USB PLL Reference Clock
          2. 7.3.1.1.2 ULPI Input Clock Configuration
          3. 7.3.1.1.3 ULPI Output Clock Configuration
          4. 7.3.1.1.4 Clock 32 kHz
          5. 7.3.1.1.5 Reset
        2. 7.3.1.2 USB Transceiver
          1. 7.3.1.2.1 PHY Electrical Characteristics
            1. 7.3.1.2.1.1 LS/FS Single-Ended Receivers
            2. 7.3.1.2.1.2 LS/FS Differential Receiver
            3. 7.3.1.2.1.3 LS/FS Transmitter
            4. 7.3.1.2.1.4 HS Differential Receiver
            5. 7.3.1.2.1.5 HS Differential Transmitter
            6. 7.3.1.2.1.6 UART Transceiver
          2. 7.3.1.2.2 OTG Characteristics
    4. 7.4 Device Functional Modes
      1. 7.4.1 TUSB1210-Q1 Modes vs ULPI Pin Status
    5. 7.5 Register Map
      1. 7.5.1  VENDOR_ID_LO
      2. 7.5.2  VENDOR_ID_HI
      3. 7.5.3  PRODUCT_ID_LO
      4. 7.5.4  PRODUCT_ID_HI
      5. 7.5.5  FUNC_CTRL
      6. 7.5.6  FUNC_CTRL_SET
      7. 7.5.7  FUNC_CTRL_CLR
      8. 7.5.8  IFC_CTRL
      9. 7.5.9  IFC_CTRL_SET
      10. 7.5.10 IFC_CTRL_CLR
      11. 7.5.11 OTG_CTRL
      12. 7.5.12 OTG_CTRL_SET
      13. 7.5.13 OTG_CTRL_CLR
      14. 7.5.14 USB_INT_EN_RISE
      15. 7.5.15 USB_INT_EN_RISE_SET
      16. 7.5.16 USB_INT_EN_RISE_CLR
      17. 7.5.17 USB_INT_EN_FALL
      18. 7.5.18 USB_INT_EN_FALL_SET
      19. 7.5.19 USB_INT_EN_FALL_CLR
      20. 7.5.20 USB_INT_STS
      21. 7.5.21 USB_INT_LATCH
      22. 7.5.22 DEBUG
      23. 7.5.23 SCRATCH_REG
      24. 7.5.24 SCRATCH_REG_SET
      25. 7.5.25 SCRATCH_REG_CLR
      26. 7.5.26 VENDOR_SPECIFIC1
      27. 7.5.27 VENDOR_SPECIFIC1_SET
      28. 7.5.28 VENDOR_SPECIFIC1_CLR
      29. 7.5.29 VENDOR_SPECIFIC2
      30. 7.5.30 VENDOR_SPECIFIC2_SET
      31. 7.5.31 VENDOR_SPECIFIC2_CLR
      32. 7.5.32 VENDOR_SPECIFIC1_STS
      33. 7.5.33 VENDOR_SPECIFIC1_LATCH
      34. 7.5.34 VENDOR_SPECIFIC3
      35. 7.5.35 VENDOR_SPECIFIC3_SET
      36. 7.5.36 VENDOR_SPECIFIC3_CLR
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Host or OTG, ULPI Input Clock Mode Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Unused Pins Connection
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Device, ULPI Output Clock Mode Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Unused Pins Connection
        3. 8.2.2.3 Application Curve
    3. 8.3 External Components
  9. 9 Power Supply Recommendations
    1. 9.1 TUSB1210 Power Supply
    2. 9.2 Ground
    3. 9.3 Power Providers
    4. 9.4 Power Modules
      1. 9.4.1 VDD33 Regulator
      2. 9.4.2 VDD18 Supply
      3. 9.4.3 VDD15 Regulator
    5. 9.5 Power Consumption
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
      1. 11.5.1 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Via Channel
    2. 12.2 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

    SLLZ066Silicon Errata. Describes the known exceptions to the functional specifications for the TUSB1210-Q1.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

11.5.1 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.