4 Revision History
Changes from Revision I (December 2019) to Revision J (July 2021)
- Updated the numbering format for tables, figures, and
cross-references throughout the documentGo
- Changed the tDC, tDD OUTPUT CLOCK delay value
From: MAX = 9 ns To: MAX = 5 ns in the Timing Requirements
Go
- Changed the tDC, tDD OUTPUT CLOCK delay value
From: MIN = blank To: MIN = 1.2 ns in the Timing Requirements
Go
- Added the Related Documentation sectionGo
Changes from Revision H (June 2015) to Revision I (December 2019)
- Changed the document from a data manual format to a TI data sheet format Go
- Changed RHB Package 32-Pin OFN To: RHB Package 32-Pin VQFN in Pin
Configuration and Functions
Go
- Changed the HBM value From: ±2 V To : ±2000 V in the ESD Ratings
Go
- Changed the tSC, tSD INPUT CLOCK value From: MAX = 3 ns To: MIN = 3 ns in the Timing Requirements
Go
- Changed the tSC, tSD OUTPUT CLOCK value From: MAX = 6 ns To: MIN = 6 ns in the Timing Requirements
Go
- Deleted section Via Channel from the Mechanical Packaging and
Orderable Information section Go
Changes from Revision G (October 2014) to Revision H (June 2015)
- Move Storage Temperature From: ESD Ratings To: Absolute Maximum Ratings
Go
- Changed the Handling Ratings table To: ESD Ratings
Go
Changes from Revision F (July 2013) to Revision G (October 2014)
- Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go