• Menu
  • Product
  • Email
  • PDF
  • Order now

  • TUSB1310A USB 3.0 Transceiver

    • SLLSE32G November   2010  – November 2017 TUSB1310A

      PRODUCTION DATA.  

  • CONTENTS
  • SEARCH
  • TUSB1310A USB 3.0 Transceiver
  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Pin Configuration and Functions
    1. 3.1 Pin Attributes
    2. 3.2 Configuration Pins
    3. 3.3 Signal Descriptions
      1. 3.3.1 PIPE
      2. 3.3.2 ULPI
      3. 3.3.3 Clocking
      4. 3.3.4 JTAG Interface
      5. 3.3.5 Reset and Output Control Interface
      6. 3.3.6 Strap Options
      7. 3.3.7 USB Interfaces
      8. 3.3.8 Special Connect
      9. 3.3.9 Power and Ground
  4. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Device Power-Consumption Summary
    5. 4.5 DC Characteristics for 1.8-V Digital I/O
    6. 4.6 Thermal Characteristics
    7. 4.7 Timing Characteristics
      1. 4.7.1 Power-Up and Reset Timing
      2. 4.7.2 PIPE Transmit
      3. 4.7.3 PIPE Receive
      4. 4.7.4 ULPI Parameters
      5. 4.7.5 ULPI Clock
      6. 4.7.6 ULPI Transmit
      7. 4.7.7 ULPI Receive Timing
    8. 4.8 Typical Characteristics
  5. 5Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 Power On and Reset
        1. 5.3.1.1 RESETN and PHY_RESETN: Hardware Reset
        2. 5.3.1.2 ULPI Reset: Software Reset
        3. 5.3.1.3 OUT_ENABLE: Output Enable
        4. 5.3.1.4 Power-Up Sequence
      2. 5.3.2 Clocks
        1. 5.3.2.1 Clock Distribution
        2. 5.3.2.2 Output Clock
      3. 5.3.3 Power State Transition Time
      4. 5.3.4 Power Management
        1. 5.3.4.1 USB Power Management
      5. 5.3.5 Receiver Status
        1. 5.3.5.1 Clock Tolerance Compensation
        2. 5.3.5.2 Receiver Detection
        3. 5.3.5.3 8b/10b Decode Errors
        4. 5.3.5.4 Elastic Buffer Errors
        5. 5.3.5.5 Disparity Errors
      6. 5.3.6 Loopback
      7. 5.3.7 Adaptive Equalizer
    4. 5.4 Device Functional Modes
      1. 5.4.1 USB 3.0 Mode
      2. 5.4.2 USB 2.0 Mode
      3. 5.4.3 ULPI Modes
    5. 5.5 Register Maps
      1. 5.5.1  Vendor ID and Product ID (00h-03h)
      2. 5.5.2  Function Control (04h-06h)
      3. 5.5.3  Interface Control (07h-09h)
      4. 5.5.4  OTG Control
      5. 5.5.5  USB Interrupt Enable Rising (0Dh-0Fh)
      6. 5.5.6  USB Interrupt Enable Falling (10h-12h)
      7. 5.5.7  USB Interrupt Status (13h)
      8. 5.5.8  USB Interrupt Latch (14h)
      9. 5.5.9  Debug (15h)
      10. 5.5.10 Scratch Register (16-18h)
  6. 6Application, Implementation, and Layout
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
        1. 6.2.1.1 Clock Source Requirements
          1. 6.2.1.1.1 Clock Source Selection Guide
          2. 6.2.1.1.2 Oscillator
          3. 6.2.1.1.3 Crystal
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 Chip Connection on PCB
          1. 6.2.2.1.1 USB Connector Pins Connection
          2. 6.2.2.1.2 Clock Connections
      3. 6.2.3 Application Curve
      4. 6.2.4 Layout
        1. 6.2.4.1 Layout Guidelines
          1. 6.2.4.1.1 High-Speed Differential Routing
          2. 6.2.4.1.2 SuperSpeed Differential Routing
        2. 6.2.4.2 Layout Example
    3. 6.3 Power Supply Recommendations
      1. 6.3.1 1.1-V and 1.8-V Digital Supply
      2. 6.3.2 1.1-V, 1.8-V and 3.3-V Analog Supplies
      3. 6.3.3 Capacitor Selection Recommendations
  7. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
      2. 7.1.2 Community Resources
    2. 7.2 Trademarks
    3. 7.3 Electrostatic Discharge Caution
    4. 7.4 Glossary
  8. 8Mechanical, Packaging, and Orderable Information
  9. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • ZAY|175
    • MPBG948B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
  • sllse32g_oa
  • sllse32g_pm
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
  • Card for each section
  • Card with all content

 

DATA SHEET

TUSB1310A USB 3.0 Transceiver

1 Device Overview

1.1 Features

  • Universal Serial Bus (USB)
    • Single Port 5.0-Gbps USB 3.0 Physical Layer Transceiver
      • One 5.0-Gbps SuperSpeed Connection
      • One 480-Mbps HS/FS/LS Connection
    • Fully Compliant With USB 3.0 Specification, Revision 1.0
    • Supports 3+ Meters USB 3.0 Cable Length
    • Fully Adaptive Equalizer to Optimize Receiver Sensitivity
    • PIPE to Link-Layer Controller
      • Supports 16-Bit SDR Mode at 250 MHz
      • Compliant With PHY Interface for the USB Architectures (PIPE), Version 3.0
    • ULPI to Link-Layer Controller
      • Supports 8-Bit SDR Mode at 60 MHz
      • Supports Synchronous Mode and Low-Power Mode
      • Compliant With UTMI+ Low Pin Interface (ULPI) Specification, Revision 1.1
  • General Features
    • IEEE 1149.1 JTAG Support
    • IEEE 1149.6 JTAG support for the SuperSpeed Port
    • Operates on One Reference Clock of 40 MHz
    • 3.3-, 1.8-, and 1.1-V Supply Voltages
    • 1.8-V PIPE and ULPI I/O
    • Available in Lead-Free 175-Ball 12- × 12-nF NFBGA Package (ZAY)

1.2 Applications

  • Surveillance Cameras
  • Digital Still Cameras
  • Multimedia Handsets
  • Phones and Smartphones
  • Portable Media Players
  • Personal Navigation Devices
  • Audio Docks
  • Video- and Wireless-IP Phones
  • Software Defined Radios

1.3 Description

The TUSB1310A device is one port, 5.0-Gbps USB 3.0 physical layer transceiver that operates off of one reference clock, which is provided by either a crystal or an external reference clock. The reference clock frequencies are selectable from 20, 25, 30, and 40 MHz. The TUSB1310A device provides the clock to the USB controller. The use of one reference clock allows the TUSB1310A device to provide a cost-effective USB 3.0 solution with few external components and a low implementation cost.

The USB controller interfaces to the TUSB1310A device through a PIPE (SuperSpeed) and a ULPI (USB 2.0) interface. The 16-bit PIPE operates off of a 250-MHz interface clock. The ULPI supports 8-bit operations with a 60-MHz interface clock.

USB 3.0 reduces active and idle power consumption with improved power-management features. The low-power states of the TUSB1310A device are controlled by the USB controller through the PIPE interface.

SuperSpeed USB uses existing USB software infrastructure by keeping the existing software interfaces and software drivers intact. In addition, SuperSpeed USB retains backward compatibility with USB 2.0 based products by using the same form-factor Type-A connector and cables. Existing USB 2.0 devices work with new USB 3.0 hosts and new USB 3.0 devices with work with legacy USB 2.0 hosts.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TUSB1310A NFBGA (175) 12.00 mm × 12.00 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.

1.4 Functional Block Diagram

TUSB1310A fbd_sllse32.gif Figure 1-1 Functional Block Diagram

2 Revision History

Changes from F Revision (August 2015) to G Revision

  • Changed the device to Not Recommended for New Designs Go
  • Changed sentence From: "The SuperSpeed USB contains SSTXP/SSTXN and SSRXP/SSRXP..." To: "The SuperSpeed USB contains SSTXP/SSTXN and SSRXP/SSRXN..." in the Overview section Go

Changes from E Revision (July 2012) to F Revision

  • Added Pin Configuration and Functions section, storage temperature to the Absolute Maximum Ratings table, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added parameter names to the DC Characteristics for 1.8-V Digital I/O tableGo

3 Pin Configuration and Functions

Figure 3-1 shows the 175-pin ZAY plastic ball grid array (NFBGA) pin assignments.

Figure 3-1 175-Pin ZAY NFBGA (Top View)

3.1 Pin Attributes

Table 3-1 Pin Types

TYPE DESCRIPTION
I Input
O Output
I/O Input/output
PD, PU Internal pullup, internal pulldown
S Strapping pin
P Power supply
G Ground

3.2 Configuration Pins

The configuration pins are not latched by RESETN.

Table 3-2 Configuration Pins

SIGNAL NAME TYPE PIN NO. MODE NAME DESCRIPTION
PHY_MODE1 I, PD H12 USB Must be set to 0. Operates as USB 3.0 transceiver.
PHY_MODE0 I, PU J12 USB Must be set to 1. Operates as USB 3.0 transceiver.

3.3 Signal Descriptions

3.3.1 PIPE

The TUSB1310A supports 16-bit SDR mode with a 250-MHz clock.

Table 3-3 PIPE Signal Descriptions

SIGNAL NAME TYPE BALL NO. DESCRIPTION
TX_CLK I K1 TX_DATA and TX_DATAK clock for source synchronous PIPE. This clock frequency is the same as PCLK frequency. The rising edge of the clock is the reference for all signals.
TX_DATA15 I G2 Parallel USB SuperSpeed data input bus.
The 16 bits represent 2 symbols of transmit data where TX_DATA7-0 is the first symbol to be transmitted, and TX_DATA15-8 is the second symbol.
TX_DATA14 H2
TX_DATA13 H1
TX_DATA12 J2
TX_DATA11 L3
TX_DATA10 L2
TX_DATA9 M2
TX_DATA8 M1
TX_DATA7 N1
TX_DATA6 P1
TX_DATA5 N2
TX_DATA4 P2
TX_DATA3 N3
TX_DATA2 P3
TX_DATA1 N4
TX_DATA0 P5
TX_DATAK1 I G1 Data/Control for the symbols of transmit data. TX_DATAK0 corresponds to the low-byte of TX_DATA, TX_DATAK1 to the upper byte.
TX_DATAK0 J1
PCLK O A6 Parallel interface data clock. All data movement across the parallel PIPE is synchronous to this clock. This clock operates at 250 MHz. The rising edge of the clock is the reference for all signals.
RX_DATA15 O B9 Parallel USB SuperSpeed data output bus.
The 16 bits represent 2 symbols of receive data where RX_DATA7-0 is the first symbol received, and RX_DATA15-8 is the second.
RX_DATA14 A9
RX_DATA13 A8
RX_DATA12 B8
RX_DATA11 B5
RX_DATA10 B4
RX_DATA9 A4
RX_DATA8 B3
RX_DATA7 A3
RX_DATA6 A2
RX_DATA5 B1
RX_DATA4 C2
RX_DATA3 C1
RX_DATA2 D1
RX_DATA1 D2
RX_DATA0 E2
RX_DATAK1 O B7 Data/Control for the symbols of receive data. RX_DATAK0 corresponds to the low-byte of RX_DATA, RX_DATAK1 to the upper byte. A value of zero indicates a data byte; a value of 1 indicates a control byte.
RX_DATAK0 A7
RX_VALID O F1 Active High. Indicates symbol lock and valid data on RX_DATA and RX_DATAK.
CONTROL AND STATUS SIGNALS
PHY_RESETN I, PU J3 Active Low. Resets the transmitter and receiver. This signal is asynchronous.
TX_DETRX_LPBK I, PD M6 Active High. Used to tell the PHY to begin a receiver detection operation or to begin loopback.
TX_ELECIDLE I K3 Active High. Forces TX output to electrical idle depending on the power state.
RX_ELECIDLE S, I/O, PD F3 Active High. While deasserted with the PHY in P0, P1, P2, or P3, indicates detection of LFPS.
RX_STATUS2 O C7 Encodes receiver status and error codes for the received data stream when receiving data.
RX_STATUS1 C6 BIT 2 BIT 1 BIT 0 DESCRIPTION
RX_STATUS0 C5 0 0 0 Received data OK
0 0 1 1 SKP ordered set added
0 1 0 1 SKP ordered set removed
0 1 1 Receiver detected
1 0 0 8B/10B decode error
1 0 1 Elastic buffer overflow
1 1 0 Elastic buffer underflow.
This error code is not used if the elasticity buffer is operating in the nominal buffer empty mode.
1 1 1 Receive disparity error
POWER_DOWN1 I G3 Power up and down the transceiver power states.
POWER_DOWN0 H3 BIT 1 BIT 0 DESCRIPTION
0 0 P0, normal operation
0 1 P1, low recovery time latency, power saving state
1 0 P2, longer recovery time latency, low-power state
1 1 P3, lowest power state
When transitioning from P3 to P0, the signaling is asynchronous.
PHY_STATUS S, I/O, PD E3 Active High. Used to communicate completion of several PHY functions including power management state transitions, rate change, and receiver detection. When this signal transitions during entry and exit from P3 and PCLK is not running, then the signaling is asynchronous.
PWRPRESENT O H11 Indicates the presence of VBUS
CONFIGURATION PINS
TX_ONESZEROS I, PD M4 Active High. Used only when transmitting USB compliance pat-terns CP7 or CP8. Causes the transmitter to transmit an alternating sequence of 50 to 250 ones and 50 to 250 zeros—regardless of the state of the TX_DATA interface.
TX_DEEMPH1 I, PD, PU K11 Selects transmitter de-emphasis. When the MAC changes, the TUSB1310A starts to transmit with the new setting within 128 ns.
TX_DEEMPH0 L11 BIT 1 BIT 0 DESCRIPTION
0 0 –6-dB de-emphasis
0 1 –3.5-dB de-emphasis
1 0 No de-emphasis
1 1 Reserved
TX_MARGIN2 I, PD M11 Selects transmitter voltage levels
TX_MARGIN1 M10 BIT 2 BIT 1 BIT 0 TX_SWING DESCRIPTION
TX_MARGIN0 M9 0 0 0 0 Normal operating range
800 mV to 1200 mV
0 0 0 1 Normal operating range
400 mV to 700 mV
0 0 1 0 800 mV to 1200 mV
1 400 mV to 700 mV
0 1 0 0 700 mV to 900 mV
1 300 mV to 500 mV
0 1 1 0 400 mV to 600 mV
1 200 mV to 400 mV
1 Don't care 0 200 mV to 400 mV
1 1 100 mV to 200 mV
TX_SWING I, PD M5 Controls transmitter voltage swing level
0: Full swing
1: Half swing
RX_POLARITY I, PD C8 Active High. Tells PHY to do a polarity inversion on the received data. Inverted data show up on RX_DATA15-0 within 20 PCLK clocks after RX_POLARITY is asserted.
0: PHY does no polarity inversion
1: PHY does polarity inversion
RX_TERMINATION I, PD D3 Controls presence of receiver terminations
0: Terminations removed
1: Terminations present
RATE I, PU L6 Controls the link signaling rate
The RATE is always 1
ELAS_BUF_MODE I, PD C9 Selects elasticity buffer operating mode
0: Nominal half full buffer mode
1: Nominal empty buffer mode

3.3.2 ULPI

The ULPI (ultra low pin count interface) is a low pin count USB PHY to a Link-Layer Controller interface. The ULPI consists of the interface and the ULPI registers. The TUSB1310A device is always the master of the ULPI bus.

Table 3-4 ULPI Signal Descriptions

SIGNAL NAME TYPE BALL NO. DESCRIPTION
ULPI_CLK O P11 60-MHz interface clock. All ULPI signals are synchronous to ULPI_CLK. The ULPI_CLK is always a 60-MHz output of the TUSB1310A device. In low-power mode, the ULPI_CLK is not driven.
ULPI_DATA7 S, I/O, PD N6 Data bus. Driven to 00h by the Link when the ULPI bus is idle.
8-bit data timed on rising edge of ULPI_CLK
ULPI_DATA6 P6
ULPI_DATA5 N7
ULPI_DATA4 P7
ULPI_DATA3 N8
ULPI_DATA2 P8
ULPI_DATA1 P9
ULPI_DATA0 N9
ULPI_DIR O M7 Controls the direction of the ULPI_DATA bus
0: ULPI_DATA lines are inputs
1: ULPI_DATA lines are outputs
ULPI_STP S, I, PU M8 Active High. The Link must assert ULPI_STP to signal the end of a USB transmit packet or a register write operation. The ULPI_STP signal must be asserted in the cycle after the last data byte is presented on the bus. The ULPI_STP has an internal weak pullup to safeguard against false commands on the ULPI_DATA lines.
ULPI_NXT O N11 Active High. The PHY asserts ULPI_NXT to throttle all data types, except register read data and the RX CMD. The PHY also asserts ULPI_NXT and ULPI_DIR simultaneously to indicate USB receive activity, if ULPI_DIR was previously low. The PHY is not allowed to assert ULPI_NXT during the first cycle of the TX CMD driven by the Link.

3.3.3 Clocking

Table 3-5 Clock Signal Name Descriptions

SIGNAL NAME TYPE BALL NO. DESCRIPTION
XI I A12 Crystal Input. This pin is the clock reference input for the TUSB1310A. The TUSB1310A device supports either a crystal unit, or a 1.8-V clock input. Frequencies supported are 20, 25, 30, or 40 MHz.
XO O A11 Crystal output. If a 1.8-V clock input is connected to XI, XO must be left open.
CLKOUT O D10 OOBCLK is driven in U3 mode.

3.3.4 JTAG Interface

The JTAG Interface is used for board-level boundary scan. All digital IO support IEEE1149.1 boundary scan and SuperSpeed differential pairs support IEEE1149.6 boundary scan.

Table 3-6 JTAG Signal Name Descriptions

SIGNAL NAME TYPE BALL NO. DESCRIPTION
JTAG_TCK I, PU G11 JTAG test clock
JTAG_TMS I, PU D11 JTAG test mode select
JTAG_TDI I, PU E11 JTAG test data input
JTAG_TRSTN I, PD E12 JTAG test asynchronous reset. Active Low. An external pulldown is required for normal operation.
JTAG_TDO O F11 JTAG test data output

3.3.5 Reset and Output Control Interface

Table 3-7 Reset and Output Control Signal Descriptions

SIGNAL NAME TYPE BALL NO. DESCRIPTION
RESETN I J11 Active Low. Resets the transmitter and receiver. This signal is asynchronous.
OUT_ENABLE I L10 Active High. This can be connected to a 1.8-V power-on-reset signal on the PCB to avoid static current and signal contention during power up.
0: Disable all driver outputs while I/O powers are supplied, but internal control circuit powers are not present during power up.
1: Enable all driver outputs during normal operation.

3.3.6 Strap Options

Strapping pins are latched by reset deassertion in the TUSB1310A device.

Table 3-8 Strapping Options(1)

SIGNAL NAME TYPE BALL NO. DESCRIPTION
XTAL_DIS
(RX_ELECIDLE) 		S, I/O, PD F3 Selects an input clock source
0: Crystal Input
1: Clock Input
SSC_DIS
(TX_MARGIN0)		 S, I, PD M9 Spread spectrum clocking disable
0: SSC enable
1: SSC disable
PIPE_16BIT
(PHY_STATUS) 		S, I/O, PD E3 Selects PIPE
0: 16-bit PIPE SDR mode
Must be 0 at reset.
ISO_START
(ULPI_DATA7) 		S, I/O, PD N6 Active High. Puts PIPE into isolate mode. When in the isolate mode, TUSB1310A device does not respond to packet data present at TX_DATA15-0, TXDATAK1-0 inputs and presents a high impedance on the PCLK, RX_DATA15-0, RX_DATAK1-0, RX_VALID outputs. When in the isolate mode, the TUSB1310A device continues to respond to ULPI. When the isolate mode bit in ULPI register is cleared, the USB interfaces starts transmitting packet data on TX_DATA15-0 and driving PCLK, RX_DATA15-0, RX_DATA1-0, and RX_VALID.
ULPI_8BIT
(ULPI_DATA6) 		S, I/O, PD P6 Selects ULPI data bus bit width
0: 8-bit ULPI SDR mode
Must be set to 0.
REFCLKSEL1,
REFCLKSEL0
(ULPI_DATA5,
ULPI_DATA4) 		S, I/O, PD N7
P7		 Select input reference clock frequency for on-chip oscillator
00: 20 MHz on XI
01: 25 MHz on XI
10: 30 MHz on XI
11: 40 MHz on XI
(1) Signals in green have double function just before reset and after reset.

3.3.7 USB Interfaces

Table 3-9 USB Interface Signal Name Descriptions

SIGNAL NAME TYPE BALL NO. DESCRIPTION
SSTXP O H14 USB SuperSpeed transmitter differential pair
SSTXM J14
SSRXP I E14 USB SuperSpeed receiver differential pair
SSRXM F14
DP I/O P14 USB non-SuperSpeed differential pair
DM P13
VBUS I N12 USB VBUS pin
Connected through an external voltage divider

3.3.8 Special Connect

Table 3-10 Special Connect Signal Descriptions

SIGNAL NAME TYPE BALL NO. DESCRIPTION
R1EXT O L14 High precision external resistor used for calibration. The R1 value shall be 10 kΩ ±1% accuracy.
R1EXTRTN I L13 R1 ground reference. This pin is not connected to board ground.
VDDA1P1 P M14 Needs a 1-µF bypass capacitor
RSVD I/O D6 Must be left open.
D5
C13
C14
K4
J4
A14

3.3.9 Power and Ground

Table 3-11 Power and Ground Signal Descriptions

SIGNAL NAME TYPE BALL NO. DESCRIPTION
VDDA3P3 P P12 Analog 3.3-V power supply
VDDA1P8 P N14 Analog 1.8-V power supply
A13
C10
VDDA1P1 P C12 Analog 1.1-V power supply
K14
G13
G14
D14
C11
VDD1P8 P B2 C3 Digital IO 1.8-V power supply
D4 D7
D8 D9
E4 F4
G4 H4
L5 L4
M3 L7
L8 L9
VDD1P1 P A5 A10 Digital 1.1-V power supply
B6 B10
E1 F2
K2 L1
N5 P4
N10 P10
K13 D13
C4
VSSA G B14 B13 Analog ground
J13 H13
F13 E13
K12 L12
G12
D12
N13
M12
M13
VSSOSC G B12 Oscillator ground
If using a crystal, this must not be connected to PCB ground plane.
See Section 6.2.2 for guidelines.
If using an oscillator, this must be connected to PCB ground.
VSS G F6 F7 Digital ground
F8 F9
G6 G7
G8 G9
J6 J7
H6 H7
H8 H9
J8 J9
B11 F12

4 Specifications

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VDD1P1 steady-state supply voltage –0.3 1.4 V
VDD1P8 steady-state supply voltage –0.3 2.45 V
VDDA1P1 steady-state supply voltage –0.3 1.4 V
VDDA1P8 steady-state supply voltage –0.3 2.45 V
VDDA3P3 steady-state supply voltage –0.3 3.8 V
Storage temperature –55 150 °C

4.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

4.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDDA3P3 Analog 3.3-supply voltage 2.97 3.3 3.63 V
VDDA1P8 Analog 1.8-supply voltage 1.71 1.8 1.98 V
VDDA1P1 Analog 1.1-supply voltage 1.045 1.1 1.155 V
VDD1P8 Digital IO 1.8-supply voltage 1.62 1.8 1.98 V
VDD1P1 Digital 1.1-supply voltage 1.045 1.1 1.155 V
VBUS Voltage at VBUS PAD 0 1.155 V
TA Operating free-air temperature –40 85 °C
TJ Operating junction temperature –40 105 °C

4.4 Device Power-Consumption Summary

over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER MIN TYP MAX UNIT
VDDA3P3 power consumption 13 mW
VDDA1P8 power consumption 77 mW
VDDA1P1 power consumption 118 mW
VDD1P1 power consumption 98 mW
VDD1P8 power consumption 128 mW
(1) Power-consumption condition is transmitting and/or receiving (in U0) at 25°C and nominal voltages.

4.5 DC Characteristics for 1.8-V Digital I/O

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH High-level input voltage 0.65 VDDS V
VIL Low-level input voltage 0.35 VDDS V
VOH High-level output voltage IO = –2 mA,
VDDS = 1.62 V to 1.98 V,
driver enabled, pullup or pulldown disabled		 VDDS – 0.45 V
IO = –2 mA,
VDDS = 1.4 V to 1.6 V,
driver enabled, pullup or pulldown disabled		 0.75 VDDS
VOL Low-level output voltage IO = 2 mA,
VDDS = 1.62 V to 1.98 V,
driver enabled, pullup or pulldown disabled		 0.45 V
IO = 2 mA,
VDDS = 1.4 V to 1.6 V,
driver enabled, pullup or pulldown disabled		 0.25 VDDS
Vhys Input hysteresis 100 270 mV
II Input current Any receiver, including those with a pullup or pulldown. The pullup or pulldown must be disabled. ±1 µA
II(PUon) Input current with pullup enabled Receiver pullup only, pullup enabled (not inhibited),
VPAD = 0 V		 –47 to –169 µA
Receiver pullup only, pullup enabled (not inhibited) –100
IOZ Off-state output current Driver only, driver disabled ±20 µA
IZ Total leakage current(1) ±20 µA
VTX_DIFF_SS SSTXP, SSTXN differential p-p TX voltage swing 0.8 1.2 V
RTX_DIFF_DC DC differential impedance 72 120 Ω
VTX_RCV_DET The amount of voltage change allowed during receiver detection 0.6 V
CAC_COUPLING AC coupling capacitor 75 200 nF
RRX_DC Receiver DC common-mode impedance 18 30 Ω
RRX_DIFF_DC DC differential impedance 72 120 Ω
VRX_LFPS_DET LFPS detect threshold 100 300 mV
VCM_AC_LFPS LFPS common-mode voltage 100 mV
VCM_LFPS_active LFPS common-mode voltage active 10 mV
VTX_DIFF_PP_LFPS LFPS differential voltage 800 1200 mV
(1) IZ is the total leakage current through the PAD connection of a driver/receiver combination that may include a pullup or pulldown. The driver output is disabled and the pullup or pulldown is inhibited.

4.6 Thermal Characteristics

THERMAL METRIC(1) TUSB1310A UNIT
ZAY (NFBGA)
175 PINS
RθJA Junction-to-ambient thermal resistance 34.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21 °C/W
RθJB Junction-to-board thermal resistance 18.4 °C/W
ψJT Junction-to-top characterization parameter 0.5 °C/W
ψJB Junction-to-board characterization parameter 17.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

4.7 Timing Characteristics

4.7.1 Power-Up and Reset Timing

The TUSB1310A device does not drive signals on any strapping pins before they are latched internally.

TUSB1310A pwr_up_rst_tmng_llse32.gif Figure 4-1 Power-Up and Reset Timing

Table 4-1 Power-Up and Reset Timing

MIN NOM MAX UNIT
Tcfgin1 Hardware configuration latch-in time from RESETN 0 ns
Tcfgin2 Time from RESETN to driver outputs on strapping pins 0 ns
RESETN pulse width 1 µs
RESETN to PHY_STATUS deassertion 300 µs

4.7.2 PIPE Transmit

TUSB1310A pipe_transmt_llse32.gif Figure 4-2 PIPE Transmit Timing

Table 4-2 PIPE Transmit Timing

MIN NOM MAX UNIT
Tcyc2 TX_CLK period 4 ns
Tdty2 TX_CLK duty cycle 50%
Tsu2 Data setup to TX_CLK rise and TX_CLK fall(1) 1 ns
Thd2 Data hold to TX_CLK rise and TX_CLK fall(1) 0 ns
(1) This includes TX_DATA15-0, TX_DATAK1-0, TX_ONESZEROS, RATE, TX_DEEMPTH, TX_DETRX_LPBK, TX_ELECIDLE, TX_MARGIN, TX_SWING, RX_POLARITY, POWER_DOWN1-0.

4.7.3 PIPE Receive

TUSB1310A pipe_receive_llse32.gif Figure 4-3 PIPE Receive Timing

Table 4-3 PIPE Receive Timing

MIN NOM MAX UNIT
Tcyc3 PCLK Period 4 ns
Tdty3 PCLK Duty Cycle 50%
Tdly3 PCLK rise and fall to RX_DATA15-0, RX_DATAK1-0, RX_VALID, RX_STATUS2-0, PHY_STATUS Delay(1)(2) 1 2 ns
(1) Output Load max = 10 pF, min = 5 pF
(2) Timing is relative to the 50% transition point, not VIH or VIL.

4.7.4 ULPI Parameters

Table 4-4 ULPI Parameters

DESCRIPTION NOTES HS FS LS UNIT
RX CMD delay PHY pipeline delays 2 to 4 2 to 4 2 to 4 clocks
TX start delay 1 to 2 1 to 10 1 to 10 clocks
TX end delay 2 to 5 clocks
RX start delay 3 to 8 clocks
RX end delay 3 to 8 17 to 18 122 to 123 clocks
Transmit-Transmit (host only) Link decision times 15 to 24 7 to 18 77 to 247 clocks
Receive-Transmit (host or peripheral) 1 to 14 7 to 18 77 to 247 clocks

4.7.5 ULPI Clock

Table 4-5 ULPI Clock Parameters

MIN NOM MAX UNIT
Fstart_8bit Frequency (first transition) ±10% 54 60 66 MHz
Fsteady Frequency (steady state) ±500 ppm 59.97 60 60.03 MHz
Dstart_8bit Duty cycle (first transition) ±10% 40% 50% 60%
Dsteady Duty cycle (steady state) ±500 ppm 49.975% 50% 50.025%
Tsteady Time to reach steady state frequency and duty cycle after first transition 1.4 ms
Tstart_dev Clock startup time after deassertion of SuspemdM – Peripheral 5.6 ms
Tstart_host Clock startup time after deassertion of SuspemdM – Hold ms
Tprep PHY preparation time after first transition of input clock µs
Tjitter Jitter ps
Trise, Tfall Rise and fall time ns

4.7.6 ULPI Transmit

TUSB1310A ulpi_transmt_tmg_llse32.gif Figure 4-4 ULPI Transmit Timing

Table 4-6 ULPI Transmit Timing

MIN NOM MAX UNIT
Tsc8, Tsd8 ULPI_STP set-up time 6 ns
Thc8, Thd8 ULPI_STP hold time 0 ns

4.7.7 ULPI Receive Timing

TUSB1310A ulpi_receive_tmg_llse32.gif Figure 4-5 ULPI Receive Timing

Table 4-7 ULPI Receive Timing

MIN NOM MAX UNIT
Tdc9, Tdd9 ULPI_DIR/ULPI_NXT/ULPI_DATA7-0(1) 9 ns
(1) Output Load MAX = 10 pF, MIN = 5 pF

4.8 Typical Characteristics

TUSB1310A C001_SLLSE32.png
Figure 4-6 TX De-emphasis
TUSB1310A C003_SLLSE32.png
Figure 4-8 Diff TX Swing versus Swing Settings
TUSB1310A C002_SLLSE32.png
Figure 4-7 TX Termination I-V

5 Detailed Description

5.1 Overview

The USB physical layer handles the low-level USB protocol and signaling, which includes data serialization and deserialization, 8b/10b encoding, analog buffers, elastic buffers, and receiver detection. It shifts the clock domain of the data from the USB rate to one that is compatible with the link-layer controller.

The SuperSpeed USB contains SSTXP/SSTXN and SSRXP/SSRXN differential pairs and uses the PIPE to communicate with the link-layer controller. The Non-SuperSpeed USB has a DP/DM differential pair and communicates with the Link-Layer Controller through the ULPI. The reference clock of the TUSB1310A device is connected to an internal crystal oscillator, spread spectrum clock, and with a PLL, which provides clocks to all functional blocks and to the CLKOUT pin for the Link-Layer Controller.

A JTAG interface is used for IEEE1149.1 and IEEE1149.6 boundary scan.

5.2 Functional Block Diagram

TUSB1310A fbd_sllse32.gif

5.3 Feature Description

5.3.1 Power On and Reset

The TUSB1310A device has two hardware reset pins, a chip reset RESETN and a logic reset PHY_RESETN. The RESETN is used only at Power On. The PHY_RESETN can be used as a functional reset. The ULPI register also has a software reset.

Until all power sources are supplied, the OUT_ENABLE pin can control the output driver enable. After all power sources are supplied, the chip reset RESETN and a ULPI soft reset is asserted by the Link Layer. The power-up sequence is described in Section 5.3.1.4.

5.3.1.1 RESETN and PHY_RESETN: Hardware Reset

The RESETN sets all internal states to initial values. The Link Layer must hold the PHY in reset through the RESETN until all power sources and the reference clock to the TUSB1310A device are stable. All pins used for strapping options must be set before RESETN deassertion as they are latched by reset deassertion. All strapping option pins have internal pullup or pulldown to set default values, but if any non-default values are desired, they need to be controlled externally by the Link-Layer Controller.

Table 5-1 Pin States in Chip Reset

PIPE CONTROL PIN NAME STATE VALUE
TX_DETRX_LPBK Inactive 0
TX_ELECIDLE Active 1
TX_ONESZEROS Inactive 0
RX_POLARITY Inactive 0
POWER_DOWN U2 10b
TX_MARGIN2-0 Normal operating range 000b
TX_DEEMP –3.5 dB 1
RATE 5.0 Gbps 1
TX_SWING Full swing or half swing 0 or 1
RX_TERMINATION Appropriate state 0 or 1

5.3.1.2 ULPI Reset: Software Reset

After power-up, the Link-Layer Controller must set the reset bit in ULPI register. It resets the core but does not reset the ULPI interface or the ULPI registers.

During the ULPI reset, the ULPI_DIR is deasserted. After the reset, the ULPI_DIR is asserted again and the TUSB1310A device sends an RX CMD update to the Link Layer. During the reset, the link must ignore signals on the ULPI_DATA7-0 and must not access the TUSB1310A.

5.3.1.3 OUT_ENABLE: Output Enable

Digital IO buffers use two power supplies, core VDD1P1 and IO VDD1P8. During power up, OUT_ENABLE must be asserted low for proper operation.

5.3.1.4 Power-Up Sequence

Figure 5-1 shows the power-up sequence.

TUSB1310A pwr_up_llse32.gif Figure 5-1 Power-Up Sequence

After proper power-supply sequencing, the reference clock on XI starts to operate. On the RESETN deassertion, REFCLKSEL1-0 is determined depending on the PHY_MODE pins, PLL is locked and the valid ULPI_CLK and the valid PCLK are driven.

After all stable clocks are provided, the TUSB1310A device allows the Link-Layer Controller to access by deasserting the ULPI_DIR. The Link-Layer Controller sets the Reset bit in the ULPI register. At the PIPE interface, the PHY_STATUS changes from high to low, which indicates that the TUSB1310A device is in the power state specified by the POWER_DOWN signal. After the PHY_STATUS change, the TUSB1310A device is ready for PIPE transactions.

5.3.2 Clocks

5.3.2.1 Clock Distribution

A source clock must be provided through XI or XO from an external crystal or from a square wave clock. The USB 3.0 PLL provides a clock to the PIPE that drives 250 MHz. The USB 2.0 PLL provides a 60-MHz clock to the ULPI.

5.3.2.2 Output Clock

The CLKOUT is used by the Link-Layer Controller or the MAC in low-power mode. A 120-MHz clock is available on the CLKOUT pin only in the USB U3 power state.

5.3.3 Power State Transition Time

The P1 to P0 transition time is the amount of time for the TUSB1310A device to return to P0 state, after having been in the P1 state. This time is measured from when the MAC sets the POWER_DOWN signals to P0 until the TUSB1310A device asserts PHY_STATUS. The TUSB1310A device asserts PHY_STATUS when it is ready to begin data transmission and reception.

The P2 to P0 transition time is the amount of time for the TUSB1310A device to return to the P0 state, after having been in the P2 state. This time is measured from when the MAC sets the POWER_DOWN signals to P0 until the TUSB1310A device asserts PHY_STATUS. The TUSB1310A device asserts PHY_STATUS when it is ready to begin data transmission and reception.

The P3 to P0 transition time is the amount of time for the TUSB1310A device to go to P0 state, after having been in the P3 state. Time is measured from when the MAC sets the POWER_DOWN signals to P0 until the TUSB1310A device deasserts PHY_STATUS. The TUSB1310A device asserts PHY_STATUS when it is ready to begin data transmission and reception.

5.3.4 Power Management

The SuperSpeed USB power state transition is controlled by the PIPE POWER_DOWN[1-0] and the Non-SuperSpeed USB power state is transitioned by setting suspendM bit in the ULPI Function control register through the ULPI or by asserting the ULPI_STP.

5.3.4.1 USB Power Management

The USB 3.0 specification improves power consumption by defining four power states, U0, U1, U2, and U3 while the PIPE specification defines P0, P1, P2 and P3. The POWER_DOWN pin states are mapped to LTSSM states as described in Table 5-2. For all power state transitions, the Link-Layer Controller must not begin any operational sequences or further power state transitions until the TUSB1310A device has indicated that the internal state transition is completed.

Table 5-2 Power States

PIPE
POWER
STATE		 USB POWER STATE PCLK PLL TRANSMITTING RECEIVING PHY_STATUS
P0 U0, all other LTSSM states On On Active or Idle or LFPS Active or Idle One cycle assertion
P1 U1 On On Idle or LFPS Idle One cycle assertion
P2 U2, RxDetect, SS.Inactive On On Idle or LFPS or RxDetect Idle One cycle assertion
P3 U3, SS.disabled Off. The PIPE is in an asynchronous mode. Off LFPS or RxDetect Idle PHY_STATUS is asserted before PCLK is turned off and deasserted when PCLK is fully off.

When the Link-Layer Controller must transmit LFPS in P1, P2, or P3 state, it must deassert TX_ELECIDLE. The TUSB1310A device generates valid LFPS until the TX_ELECIDLE is asserted. The Link-Layer Controller must assert TX_ELECIDLE before transitioning to P0.

When RX_ELECIDLE is deasserted in P0, P1, P2, or P3, the TUSB1310A device receiver monitors for LFPS except during reset or when RX_TERMINATION is removed for electrical idle.

When the TUSB1310A device is in P0 and is actively transmitting; only RX_POLARITY can be asserted.

Table 5-3 PIPE Control Pin Matrix

POWER STATE TX_DETRX_LPBK TX_ELECIDLE DESCRIPTION
P0 0 0 Transmitting data on TX_DATA
0 1 Not transmitting and is in electrical idle
1 0 Goes into loopback mode
1 1 Transmits LFPS signaling
P1 Don’t care 0 Transmits LFPS signaling
1 Not transmitting and is in electrical idle
P2 Don’t care 0 Transmits LFPS signaling
0 1 Idle
1 1 Does a receiver detection operation
P3 Don’t care 0 Transmits LFPS signaling
1 Does a receiver detection operation

5.3.5 Receiver Status

The TUSB1310A device has an elastic buffer for clock tolerance compensation, the Link Partner detection, and some received data error detections. The receive data status from SSRXP/SSRXN differential pair presents on RX_STATUS2-0. If an error occurs during a SKP ordered-set (a set of symbols transmitted as a group), the error signaling has precedence. If more than one error occurs on a received byte, the errors have the following priority:

  1. 8B/10B decode error
  2. Elastic buffer overflow
  3. Elastic buffer underflow (cannot occur in nominal empty buffer model)
  4. Disparity error

5.3.5.1 Clock Tolerance Compensation

The receiver contains an elastic buffer used to compensate for differences in frequencies between bit rates at the two ends of a Link. The elastic buffer must be capable of holding enough symbols to handle worst case differences in frequency and worst case intervals between SKP ordered-sets. A SKP order-set is a set of symbols transmitted as a group. The SKP ordered-sets allows the receiver to adjust the data stream being received prevent the elastic buffer from either overflowing or under-flowing due to any clock tolerance differences.

The TUSB1310A device supports two models, nominal half-full buffer model and nominal empty-buffer mode. For the nominal half-full buffer model, the TUSB1310A device monitors the receive data stream. When a SKP ordered-set is received, the TUSB1310A device adds or removes one SKP order set from each SKP to manage its elastic buffer to keep the buffer as close to half full as possible. Only full SKP ordered sets are added or removed. When a SKP order set is added, the TUSB1310A device asserts an Add SKP code (001b) on the RX_STATUS for one clock cycle. When a SKP order set is removed, the RX_STATUS has a Remove SKP code (010b).

For the nominal empty-buffer model, the TUSB1310A device tries to keep the elasticity buffer as close to empty as possible. When no SKP ordered sets have been received, the TUSB1310A device is required to insert SKP ordered sets into the received data stream.

Table 5-4 RX_STATUS: SKP

RX_STATUS2-0 SKP ADDITION OR REMOVAL LENGTH
001b 1 SKP Ordered Set added One clock cycle
010b 1 SKP Ordered Set removed

5.3.5.2 Receiver Detection

TX_DETRX_LPBK starts a receiver detection operation to determine if there is a receiver at the other end of the link. When the receiver detect sequence completes, the PHY_STATUS is asserted for one clock and drives the RX_STATUS signals to the appropriate code. When the TX_DETRX_LPBK signal is asserted, the Link-Layer Controller must leave the signal asserted until the PHY_STATUS pulse. When receiver detection is performed in P3, the PHY_STATUS shows the appropriate receiver detect value until the TX_DETRX_LPBK is deasserted.

Table 5-5 RX_STATUS: Receiver Detection

RX_STATUS2-0 DETECTED CONDITION LENGTH
000b Receiver not present One clock cycle
011b Receiver present

5.3.5.3 8b/10b Decode Errors

When the TUSB1310A device detects an 8b/10b decode error, it asserts a SUB symbol in the data on the RX_DATA where the bad byte occurred. In the same clock cycle that the SUB symbol is asserted on the RX_DATA, the 8b/10b decode error code (100b) is asserted on the RX_STATUS. An 8b/10b decoding error has priority over all other receiver error codes and could mask out a disparity error occurring on the other byte of data being clocked onto the RX_DATA with the SUB symbol.

Table 5-6 8b/10b Decode Errors

RX_STATUS2-0 DETECTED ERROR LENGTH
100b 8B/10B Decode Error Clock cycles during the effected byte is transferred on RX_DATA15-0

5.3.5.4 Elastic Buffer Errors

When the elastic buffer overflows, data is lost during the reception of the data. The elastic buffer overflow error code (101b) is asserted on the RX_STATUS on the PCLK cycle the omitted data would have been asserted. The data asserted on the RX_DATA is still valid data, the elastic buffer overflow error code on the RX_STATUS just marks a discontinuity point in the data stream being received.

When the elastic buffer underflows, SUB symbols are inserted into the data stream on the RX_DATA to fill the holes created by the gaps between valid data. For every PCLK cycle a SUB symbol is asserted on the RX_DATA, an elastic buffer underflow error code (111b) is asserted on the RX_STATUS. In nominal empty-buffer mode, SKP ordered sets are transferred on RX_DATA and the underflow is not signaled.

Table 5-7 Elastic Buffer Errors

RX_STATUS2-0 DETECTED ERROR LENGTH
101b Elastic Buffer overflow Clock cycles the omitted data would have appeared
110b Elastic Buffer underflow Clock cycles during the SUB symbol presence on RX_DATA15-0

5.3.5.5 Disparity Errors

When the TUSB1310A device detects a disparity error, it asserts a disparity error code (111b) on the RX_STATUS in the same PCLK cycle it asserts the erroneous data on the RX_DATA. The disparity code does not discern which byte on the RX_DATA is the erroneous data.

Table 5-8 Disparity Errors

RX_STATUS2-0 DETECTED ERROR LENGTH
111b Disparity Error Clock cycles during the effected byte is transferred on RX_DATA15-0

5.3.6 Loopback

The TUSB1310A device begins an internal-loopback operation from SSRXP/SSRXN differential pairs to SSTXP/SSTXN differential pairs when the TX_DETRX_LPBK is asserted while holding TX_ELECIDLE deasserted. The TUSB1310A device stops transmitting data to the SSTXP/SSTXN signaling pair from the TX_DATA and begins transmitting on the SSTXP/SSTXN signaling pair the data received at the SSRXP/SSRXN signaling pair. This data is not routed through the 8b/10b coding/encoding paths. While in the loopback operation, the received data is still sent to the RX_DATA. The data sent to the RX_DATA is routed through the 10b/8b decoder.

The TX_DETRX_LPBK deassertion terminates the loopback operation and returns to transmitting TX_DATA over the SSTXP/SSTXN signaling pair. The TUSB1310A device only transitions out of loopback on detection of LFPS signaling by transitioning to P2 state and starting the LFPS handshake.

5.3.7 Adaptive Equalizer

The adaptive equalizer dynamically adjusts the forward gain and peaking of the analog equalizer to minimize the jitter at the cross over point of the eye diagram, which allows for greater jitter tolerance in the RX.

5.4 Device Functional Modes

USB 3.0 is a physical SuperSpeed bus combined in parallel with a physical USB 2.0, according to the USB 3.0 Specification. Each PHY operates independently on a separate data bus. Following this specification, the USB architecture of the TUSB1310A device achieves different working modes. Simultaneous operation of USB 3.0 and USB 2.0 modes is not allowed for peripheral devices.

5.4.1 USB 3.0 Mode

At an electrical level, each SuperSpeed differential link is initialized by enabling its receiver termination. The transmitter is responsible for detecting the far end receiver termination as an indication of a bus connection and informing the link layer so the connect status can be factored into link operation and management. The SuperSpeed link is disabled, for example, when the low impedance receiver termination of a port is removed.

5.4.2 USB 2.0 Mode

When the TUSB1310A is connected to an electrical environment that only supports high-speed, full-speed, or low-speed connections, the SuperSpeed USB 3.0 connectivity is disabled. In this case, the USB 2.0 capabilities are compliant with the USB 2.0 specification.

5.4.3 ULPI Modes

The TUSB1310A device supports synchronous mode and low-power mode. The default mode is synchronous mode.

The synchronous mode is a normal operation mode. The ULPI_DATA are synchronous to ULPI_CLK. The low-power mode is used during power down and no ULPI_CLK. The TUSB1310A device sets ULPI_DIR to output and drives LineState signals and interrupts.

Table 5-9 ULPI Synchronous and Low-Power Mode Functions

SYNCHRONOUS LOW POWER
ULPI_CLK(OUT)
ULPI_DATA7(I/O)
ULPI_DATA6(I/O)
ULPI_DATA5(I/O)
ULPI_DATA4(I/O)
ULPI_DATA3(I/O) ULPI_INT (OUT)
ULPI_DATA2(I/O)
ULPI_DATA1(I/O) ULPI_LINESTATE1(OUT)
ULPI_DATA0(I/O) ULPI_LINE_STATE0 (OUT)
ULPI_DIR(OUT)
ULPI_STP(IN)
ULPI_NXT(OUT)

5.5 Register Maps

Table 5-10 Register Definitions

ACCESS CODE EXPANDED NAME DESCRIPTION
Rd Read Register can be read. Read-only if this is the only mode given.
Wr Write Pattern on the data bus is written over all bits of the register.
S Set Pattern on the data bus is OR'd with and written into the register.
C Clear Pattern on the data bus is a mask. If a bit in the mask is set, then the corresponding register bit is set to zero (cleared).

The TUSB1310A device contains the ULPI registers consisting of an immediate register set and an extended register set.

Table 5-11 Register Map

REGISTER NAME ADDRESS (6 BITS)
Rd Wr Set Clr
IMMEDIATE REGISTER SET
Vendor ID Low 00h
Vendor ID High 01h
Product ID Low 02h
Product ID High 03h
Function Control 04h–06h 04h 05h 06h
Interface Control 07h–09h 07h 08h 09h
OTG Control 0Ah–0Ch 0Ah 0Bh 0Ch
USB Interrupt Enable Rising 0Dh–0Fh 0Dh 0Eh 0Fh
USB Interrupt Enable Falling 10h–12h 10h 11h 12h
USB Interrupt Status 13h 13h
USB Interrupt Latch 14h 14h
Debug 15h
Scratch Register 16h–18h 16h 17h 18h
Reserved 19h–2Eh

5.5.1 Vendor ID and Product ID (00h-03h)

Table 5-12 Vendor ID and Product ID

ADDRESS BITS NAME ACCESS RESET DESCRIPTION
00h 7:00 Vendor ID Low Rd 51h Lower byte of vendor ID supplied by USB-IF
01h 7:00 Vendor ID High Rd 04h Upper byte of vendor ID supplied by USB-IF
02h 7:00 Product ID Low Rd 10h Lower byte of vendor ID supplied by vendor
03h 7:00 Product ID High Rd 13h Upper byte of vendor ID supplied by vendor

5.5.2 Function Control (04h-06h)

Address: 04h-06h (Read), 04h (Write), 05h (Set), 06h (Clear)

Table 5-13 Function Control

BITS NAME ACCESS RESET DESCRIPTION
1:0 XcvrSelect Rd, Wr, S, C 1h Selects the required transceiver speed 00b : Enable HS transceiver
01b: Enable FS transceiver
10b: Enable LS transceiver
11b: Enable FS transceiver for LS packets
(FS preamble is automatically prepended)
2 TermSelect Rd, Wr, S, C 0 Controls the internal 1.5-kΩ pullup resister and 45-Ω HS terminations. Control over bus resistors changes depending on XcvrSelect, OpMode, DpPulldown and DmPulldown. Because low speed peripherals never support full speed or hi-speed, providing the 1.5 kΩ on DM for low speed is optional.
4:3 OpMode Rd, Wr, S, C 00 Selects the required bit encoding style during transmit
00 : Normal operation
01: Nondriving
10: Disable bit-stuff and NRZI encoding
11: Do not automatically add SYNC and EOP when transmitting. Must be used only for HS packets.
5 Reset Rd, Wr, S, C 0 Active High transceiver reset. After the Link sets this bit, the TUSB1310A device must assert the ULPI_DIR and reset the ULPI. When the reset is completed, the PHY deasserts the ULPI_DIR and automatically clears this bit. After deasserting the ULPI_DIR, the PHY must re-assert the ULPI_DIR and send an RX CMD update on the Link-Layer Controller. The Link-Layer Controller must wait for the ULPI_DIR to deassert before using the ULPI bus. Does not reset the ULPI or ULPI register set.
6 SuspendM Rd, Wr, S, C 1h Active low PHY suspend. Put the TUSB1310A device into low-power mode. The PHY can power down all blocks except the full speed receiver, OTG com-parators, and the ULPI pins. The PHY must automatically set this bit to 1 when low-power mode is exited.
0: Low-power mode
1: Powered
7 Reserved Rd 0 Reserved

5.5.3 Interface Control (07h-09h)

Address: 07-09h (Read), 07h (Write), 08h (Set), 09h (Clear)

Table 5-14 Interface Control

BITS NAME ACCESS RESET DESCRIPTION
0 Reserved Rd 0b Reserved, only write a 0 to this bit
1 Reserved Rd 0b Reserved, only write a 0 to this bit
2 Reserved Rd 0h Reserved
3 ClockSuspendM Rd, Wr, S, C 0b Active low clock suspend. Valid only in serial mode. Powers down the internal clock circuitry only. Valid only when SuspendM = 1. The TUSB1310A device must ignore ClockSuspend when SuspendM = 0. By default, the clock is not be powered in serial mode.
0 : Clock is not powered in serial mode
1 : Clock is powered in serial mode
6:4 Reserved Rd 0h Reserved
7 Interface
Protect Disable		 Rd, Wr, S, C 0 Controls internal pull-ups and pull-downs on both the ULPI_STP and the ULPI_DATA for protecting the ULPI when the Link-Layer Controller puts the signals to tri-state value.
0 Enables the pullup and pulldown
1 Disables the pullup and pulldown

5.5.4 OTG Control

Address: 0Ah-0Ch (Read), 0Ah (Write), 0Bh (Set), 0Ch (Clear). Controls UTMI+ OTG functions of the PHY.

Table 5-15 OTG Control Register

BITS NAME ACCESS RESET DESCRIPTION
0 Reserved Rd 0b This bit is not implemented and returns a 0b when read
1 DpPulldown Rd, Wr, S, C 1b Enables the 15-kΩ pulldown resistor on D+
0 Pulldown resistor not connected to D+
1 Pulldown resistor connected to D+
2 DmPulldown Rd, Wr, S, C 1h Enables the 15-kΩ pulldown resistor on D–
0 Pulldown resistor not connected to D–
1 Pulldown resistor connected to D–
7:3 Reserved Rd 0h These bits are not implemented and return zeros when read

5.5.5 USB Interrupt Enable Rising (0Dh-0Fh)

Address: 0D-0Fh (Read), 0Dh (Write), 0Eh (Set), 0Fh (Clear)

Table 5-16 USB Interrupt Enable Rising

BITS NAME ACCESS RESET DESCRIPTION
0 Hostdisconnect Rise Rd, Wr, S, C 1b Generate an interrupt event notification when Hostdisconnect changes from low to high. Applicable only in host mode (DpPulldown and DmPulldown both set to 1b).

5.5.6 USB Interrupt Enable Falling (10h-12h)

Address: 10-12h (Read), 10h (Write), 11h (Set), 12h (Clear)

Table 5-17 USB Interrupt Enable Falling

BITS NAME ACCESS RESET DESCRIPTION
0 Hostdisconnect Fall Rd, Wr, S, C 1b Generate an interrupt event notification when Host-disconnect changes from high to low. Applicable only in host.

5.5.7 USB Interrupt Status (13h)

Address: 13h (Read-only)

Table 5-18 USB Interrupt Status

BITS NAME ACCESS RESET DESCRIPTION
0 Hostdisconnect Fall Rd, Wr, S, C 1b Generate an interrupt event notification when Host-disconnect changes from high to low. Applicable only in host.

5.5.8 USB Interrupt Latch (14h)

Address: 14h (Read-only with auto-clear)

Table 5-19 USB Interrupt Latch

BITS NAME ACCESS RESET DESCRIPTION
0 Hostdisconnect Fall Rd, Wr, S, C 1b Set to 1b by the PHY when an unmasked event occurs on Host-disconnect. Cleared when this register is read. Applicable only in host mode.

5.5.9 Debug (15h)

Address: 15h (Read-only)

Table 5-20 Debug

BITS NAME ACCESS RESET DESCRIPTION
0 LineState0 Rd 0 Contains the current value of LineState0
1 LineState1 Rd 0 Contains the current value of LineState1
7:2 Reserved Rd 0 Reserved

5.5.10 Scratch Register (16-18h)

Address: 16-18h (Read), 16h (Write), 17h (Set), 18h (Clear)

Table 5-21 Scratch Register

BITS NAME ACCESS RESET DESCRIPTION
7:0 Scratch Rd, Wr, S, C 00 Empty register byte for testing purposes. Software can read, write, set, and clear this register and the TUSB1310A device functionality is not be affected.

6 Application, Implementation, and Layout

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

6.1 Application Information

Texas Instruments’ TUSB1310A device is a single port, 5.0-Gbps USB 3.0 physical layer transceiver that is available in a lead-free, 175-ball, 12-mm × 12-mm NFBGA package (ZAY). The link controller interfaces to the TUSB1310A device are through a PIPE (16-bit wide operating at 250 MHz) and a ULPI (8-bit wide operating at 60 MHz) interface. The USB connector interfaces to the TUSB1310A device through a USB 3.0 SuperSpeed USB differential pair (TX and RX) and USB 2.0 differential pair (DP/DM).

6.2 Typical Application

Figure 6-1 represents a typical implementation of the TUSB1310A USB 3.0 physical layer transceiver that operates off of a single crystal or an external reference clock. The reference frequencies are selectable from 20, 25, 30, and 40 MHz. The TUSB1310A device provides a clock to the USB link layer controllers. The single reference clock allows the TUSB1310A device to provide a cost effective USB 3.0 solution with few external components and a minimum implementation cost.

TUSB1310A typ_sys_llse32.gif Figure 6-1 Typical Application Schematic

6.2.1 Design Requirements

6.2.1.1 Clock Source Requirements

6.2.1.1.1 Clock Source Selection Guide

Reference clock jitter is an important parameter. Jitter on the reference clock degrades both the transmit eye and receiver jitter tolerance, no matter how clean the rest of the PLL is, thereby impairing system performance. Additionally, a particularly jittery reference clock may interfere with PLL lock detection mechanism, forcing the lock detector to issue an unlock signal. A good quality, low jitter reference clock is required to achieve compliance with supported USB 3.0 standards. For example, USB 3.0 specification requires the random jitter (RJ) component of either RX or TX to be 2.42 ps (random phase jitter calculated after applying jitter transfer function [JTF]). As the PLL typically has a number of additional jitter components, the reference clock jitter must be considerably below the overall jitter budget.

6.2.1.1.2 Oscillator

If an external clock source is used, XI must be tied to the clock source and XO must be left floating.

Table 6-1 Oscillator Specification

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Frequency tolerance Operational temperature ±50 ppm
Frequency stability 1 year aging ±50 ppm
Rise and Fall time 20% to 80% 6 nsec
Reference clock RJ with JTF (1 sigma)(1)(2) 0.8 psec
Reference clock TJ with JTF (total p-p)(2)(3) 25 psec
Reference clock jitter (absolute p-p)(4) 50 psec
(1) Sigma value assuming Gaussian distribution
(2) After application of JTF
(3) Calculated as 14.1 × RJ + DJ
(4) Absolute phase jitter (p-p)

6.2.1.1.3 Crystal

Either a 20-MHz, 25-MHz, 30-MHz, or 40-MHz crystal can be selected. A parallel, 20-pF load crystal must be used if a crystal source is used.

Table 6-2 Crystal Specification

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Frequency tolerance Operational temperature ±50 ppm
Frequency stability 1 year aging ±50 ppm
Load capacitance 12 20 24 pF

6.2.2 Detailed Design Procedure

6.2.2.1 Chip Connection on PCB

Components must be placed close to the TUSB1310A device to reduce the trace length of the interface between the components and the TUSB1310A. If external capacitors cannot accommodate a close placement, shielding to ground is recommended.

TUSB1310A analg_pin1_llse32.gif Figure 6-2 Analog Pin Connections

6.2.2.1.1 USB Connector Pins Connection

The following rules apply for differential pair signals (DP/DM, SSTXP/SSTXN, and SSRXP/SSRXN):

  • Keep as short as possible
  • Must be trace-length matched and parallelism must be maintained
  • Minimize vias and corners
  • Avoid crossing plane splits and stubs

Figure 6-3 and Figure 6-4 are for visual reference only.

TUSB1310A usb_std_a_llse32.gif Figure 6-3 USB Standard-A Connector Pin Connection
TUSB1310A usb_std_b_llse32.gif Figure 6-4 USB Standard-B Connector Pin Connection

6.2.2.1.2 Clock Connections

The TUSB1310A device supports an external oscillator source or a crystal unit. If a clock is provided to XI instead of a crystal, XO is left open. Otherwise, if a crystal is used, the connection must adhere to the following guidelines.

Because XI and XO are coupled to other leads and supplies on the PCB, it is important to keep them as short as possible and away from any switching leads. It is also recommended to minimize the capacitance between XI and XO. This can be accomplished by connecting the VSSOSC lead to the two external capacitors CL1 and CL2 and shielding them with the clean ground lines. The VSSOSC must not be connected to PCB ground.

Load capacitance (CLOAD) of the crystal varying with the crystal vendors is the total capacitance value of the entire oscillation circuit system as seen from the crystal. It includes two external capacitors CL1 and CL2 in Figure 6-5. The trace length between the decoupling capacitors and the corresponding power pins on the TUSB1310A device must be minimized. It is also recommended that the trace length from the capacitor pad to the power or ground plane be minimized.

TUSB1310A typ_crystal_conn_llse32.gif Figure 6-5 Typical Crystal Connections

6.2.3 Application Curve

TUSB1310A app_curve_eye_diag_NEW_sllse32.png Figure 6-6 Super Speed Eye Diagram

6.2.4 Layout

6.2.4.1 Layout Guidelines

6.2.4.1.1 High-Speed Differential Routing

  1. The high-speed differential pair (USB_DM and USB_DP) is connected to a type A USB connecter.
  2. The differential pair traces should be routed with 90 Ω ±15% differential impedance.
  3. The high-speed signal pair should be trace length matched.
  4. Max trace length mismatch between high speed USB signal pairs should be no greater than 150 mils.
  5. Keep total trace length to a minimum, if routing longer than eight inches contact TI to address signal integrity concerns.
  6. Route differential traces first.
  7. Route the differential pairs on the top or bottom layers with the minimum amount of vias possible.
  8. No termination or coupling caps are required.
  9. If a common mode choke is required then place the choke as close as possible to the USB connector signal pins.
  10. Likewise ESD clamps should also be placed as close as possible to the USB connector signal pins (closer than the choke).
  11. For more detailed information, refer to USB 2.0 Board Design and Layout Guidelines (SPRAAR7), which describes general PCB design and layout guidelines for the USB 2.0 differential pair (DP/DM).

6.2.4.1.2 SuperSpeed Differential Routing

  1. SuperSpeed consists of two differential routing pairs: a transmit pair (USB_SSTXM and USB_SSTXP) and a receive pair (USB_SSRXM and USB_SSRXP).
  2. Each differential pair trace must be routed with 90 Ω ±15% differential impedance.
  3. The high-speed signal pair must be trace-length matched. Maximum trace length mismatch between SuperSpeed USB signal pairs must be no greater than 5 mils. The total length for each differential pair can be no longer than eight inches, which is based on the SuperSpeed USB compliance channel specification and must be avoided if at all possible. TI recommends that the SuperSpeed differential pairs be as short as possible.
  4. The transmit differential pair does not have to be the same length as the receive differential pair. Keep total trace length to a minimum. Route differential traces first. Route the differential pairs on the top or bottom layers with the minimum amount of vias possible.
  5. The transmitter differential pair requires 0.1-µF coupling capacitors for proper operation. The package or case size of these capacitors must be no larger than 0402. C-packs are not allowed. The capacitors must be placed symmetrically as close as possible to the USB connector signal pins.
  6. If a common mode choke is required, place the choke as close as possible to the USB connector signal pins (closer than the transmitter capacitors).
  7. Likewise, ESD clamps must also be placed as close as possible to the USB connector signal pins (closer than the choke and transmitter capacitors).
  8. It is permissible to swap the plus and minus on either or both of the SuperSpeed differential pairs, which may be necessary to prevent the differential traces from crossing over one another. However, it is not permissible to swap the transmitter differential pair with the receive differential pair.
  9. It is recommended to use a 2010 pad for the inside pins, provided no pad is used for adjacent pins. Instead, use a pad on one of the inside pins for the next pad route the trace between the outer pins to a via. There is enough space to route a 3.78-mil trace between the outside pads while leaving 5-mil spacing between the trace and pad; it is then possible to increase the trace width to 4 mils after the breakout.
  10. In Figure 6-7 the red pads are USB_SS_RXP/USB_SS_RXN and the blue pads are USB_SS_TXP/USB_SS_TXN.

6.2.4.2 Layout Example

TUSB1310A layout_example_sllse32.gif Figure 6-7 Layout Example

6.3 Power Supply Recommendations

6.3.1 1.1-V and 1.8-V Digital Supply

The TUSB1310A requires 1.1-V and 1.8-V digital power sources. Both VDD1P1 and VDD1P8 supplies must have 0.1-μF bypass capacitors to VSS (ground) in order for proper operation. The recommendation is one capacitor for each power terminal. Place the capacitor as close as possible to the terminal on the device and keep trace length to a minimum. Smaller value capacitors like 0.01-μF are also recommended on the digital supply terminals. When placing and connecting all bypass capacitors, high-speed board design rules must be followed.

6.3.2 1.1-V, 1.8-V and 3.3-V Analog Supplies

Because circuit noise on the analog power terminals must be minimized, a Pi-type filter is recommended for each supply. Analog power terminals must have a 0.1-μF bypass capacitor connected to VSSA (ground) for proper operation. Place the capacitor as close as possible to the terminal on the device and keep trace length to a minimum. Smaller value capacitors (0.01-μF) are also recommended on the analog supply terminals.

6.3.3 Capacitor Selection Recommendations

When selecting bypass capacitors for the TUSB1310A device, X7R-type capacitors are recommended. The frequency versus impedance curves, quality, stability, and cost of these capacitors make them a logical choice for most computer systems.

The selection of bulk capacitors with low-ESR specifications is recommended to minimize low frequency power supply noise. Today, the best low-ESR bulk capacitors are radial leaded aluminum electrolytic capacitors. These capacitors typically have ESR specifications that are less than 0.01 Ω at 100 kHz. Also, several manufacturers sell D-size surface mount specialty polymer solid aluminum electrolytic capacitors with ESR specifications slightly higher than 0.01 Ω at 100 kHz. Both of these bulk capacitor options significantly reduce low frequency power supply noise and ripple.

7 Device and Documentation Support

7.1 Documentation Support

7.1.1 Related Documentation

The following documents describe the TUSB1310A transceiver. Copies of these documents are available on the Internet at www.ti.com.

    (SPRAAR7) High-Speed Interface Layout Guidelines
    (SPRAA99) nFBGA Packaging
    (SLLU123) TUSB1310 Implementation Guide
    (SLLZ063) TUSB1310A Errata

7.1.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

7.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

7.3 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.4 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.

8 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

IMPORTANT NOTICE

Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.

TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services.

Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agrees that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their systems and products, and have full and exclusive responsibility to assure the safety of their products and compliance of their products (and of all TI products used in or for such Designers’ products) with all applicable regulations, laws and other applicable requirements. Designers represent that, with respect to their applications, they have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designers agree that prior to using or distributing any systems that include TI products, they will thoroughly test such systems and the functionality of such TI products as used in such systems.

TI’s provision of reference designs and any other technical, applications or design advice, quality characterization, reliability data or other information or services does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such reference designs or other items.

Designers are authorized to use, copy and modify any individual TI reference design only in connection with the development of end products that include the TI product(s) identified in that reference design. HOWEVER, NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of the reference design or other items described above may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

TI REFERENCE DESIGNS AND OTHER ITEMS DESCRIBED ABOVE ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING THE REFERENCE DESIGNS OR USE OF THE REFERENCE DESIGNS, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.

TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNERS AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS AS DESCRIBED IN A TI REFERENCE DESIGN OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THE REFERENCE DESIGNS OR USE OF THE REFERENCE DESIGNS, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.

Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.

TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection.

Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-compliance with the terms and provisions of this Notice.

IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated

 
Texas Instruments

© Copyright 1995-2025 Texas Instruments Incorporated. All rights reserved.
Submit documentation feedback | IMPORTANT NOTICE | Trademarks | Privacy policy | Cookie policy | Terms of use | Terms of sale