• Menu
  • Product
  • Email
  • PDF
  • Order now

  • TUSB211 USB 2.0 High Speed Signal Conditioner

    • SLLSEO0D May   2015  – October 2017 TUSB211

      PRODUCTION DATA.  

  • CONTENTS
  • SEARCH
  • TUSB211 USB 2.0 High Speed Signal Conditioner
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
      1. 7.3.1 Low Speed (LS) Mode
      2. 7.3.2 Full Speed (FS) Mode
      3. 7.3.3 High Speed (HS) Mode
      4. 7.3.4 Disable Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 For a Host Side Application
        2. 8.2.2.2 For a Device Side Application
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • RWB|12
    • MPQF391C
Thermal pad, mechanical data (Package|Pins)
Orderable Information
  • sllseo0d_oa
  • sllseo0d_pm
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
  • Card for each section
  • Card with all content

 

DATA SHEET

TUSB211 USB 2.0 High Speed Signal Conditioner

1 Features

  • Compatible with USB 2.0, OTG 2.0 and BC 1.2
  • Support for LS, FS, HS signaling
  • Active Power Consumption of 55 mW (Typical) with 3.3-V Single Supply
  • Selectable Signal Gain Via External Pulldown Resistor
  • Does Not Break DP, DM Trace
  • Scalable Solution – Daisy Chain Device for High Loss Applications
  • Compact 1.6 mm x 1.6 mm QFN Package

2 Applications

  • Notebooks
  • Desktops
  • Docking Stations
  • Cell Phones
  • Active Cable, Cable Extenders
  • Backplane
  • Televisions
  • Tablets

3 Description

The TUSB211 is a USB High-Speed (HS) signal conditioner, designed to compensate for ISI signal loss in a transmission channel.

The device has a patent-pending design which is agnostic to USB Low Speed (LS) and Full Speed (FS) signals. LS and FS signal characteristics are unaffected by the TUSB211. HS signals are compensated.

Programmable signal gain permits fine tuning device performance to optimize High Speed signals at the connector. This helps to pass USB High Speed electrical compliance tests.

The footprint of TUSB211 does not break the continuity of the DP/DM signal path. This permits risk free system design of a complete USB channel.

In addition, TUSB211 is compatible with the USB On-The-Go (OTG) and Battery Charging (BC) protocols

Device Information (1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TUSB211 X2QFN (12) 1.60 mm x 1.60 mm
TUSB211I
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Simplified Schematic

TUSB211 TUSB211I fp_schematic_sllseo0.gif

4 Revision History

Changes from C Revision (June 2016) to D Revision

  • Deleted device TUSB211-Q1 From the data sheetGo
  • Deleted Features: Qualified for Automotive ApplicationsGo
  • Deleted Applications: Automotive InfotainmentGo

Changes from A Revision (June 2015) to B Revision

  • Changed From: 1-page datasheet To: Full datasheet Go
  • Added Features: Qualified for Automotive ApplicationsGo
  • Deleted Features: –40°C to 85°C Industrial Temperature RangeGo
  • Added Applications: Automotive InfotainmentGo
  • Changed the Simplified SchematicGo

Changes from * Revision (May 2015) to A Revision

  • Changed the data sheet From: Product Preview To: Production Go

5 Pin Configuration and Functions

RWB Package
12 Pin (X2QFN)
Top View
TUSB211 TUSB211I po_sllso9.gif

Pin Functions

PIN I/O INTERNAL
PULLUP/PULLDOWN		 DESCRIPTION
NAME NO.
VCC 12 P N/A 3.3-V power
VREG 11 O RSTN asserted: 30 kΩ PD 1.8-V LDO output. Only enabled when operating in High Speed mode. Requires 0.1-µF external capacitor to GND to stabilize the core.
FS, LS mode: 30 kΩ PD
HS mode: N/A
GND 10 P N/A Ground
RSTN 5 I 500 kΩ PU Device disable/enable.
Recommend 0.1-µF external capacitor to GND to ensure clean power on reset if not driven.
EQ 6 I N/A USB High Speed boost select via external pull down resistor.
Sampled upon power up.
Auto selects min EQ when left floating.
Does not recognize real time adjustments.
D1P 2 I/O N/A USB High Speed positive port.
Orientation independent – Can face either upstream or downstream.
D1M 1 I/O N/A USB High Speed negative port.
Orientation independent – Can face either upstream or downstream.
D2P 7 I/O N/A USB High Speed positive port.
Orientation independent – Can face either upstream or downstream.
D2M 8 I/O N/A USB High Speed negative port.
Orientation independent – Can face either upstream or downstream.
TEST 3 I RSTN asserted: 500 kΩ PD No function. Leave floating.
ENA_HS 9 O RSTN asserted: 500kΩ PD Flag indicating that channel is in High Speed mode. Asserted upon:
  1. Detection of USB-IF High Speed test fixture from an unconnected state followed by transmission of USB TEST_PACKET pattern.
  2. Squelch detection following USB reset with a successful HS handshake [HS handshake is declared to be successful after single chirp J chirp K pair where each chirp is within 18 µs – 128 µs]

De-asserted upon detection of disconnect or suspend.
Can be left floating if not needed.
CD 4 O RSTN asserted: 500 kΩ PD Flag indicating that a USB device is attached.
Asserted from an unconnected state upon detection of DP or DM pull-up resistor.
De-asserted upon detection of disconnect.
Can be left floating if not needed.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage range VCC –0.3 3.8 V
Voltage range D1P, D1M, D2P, D2M, RSTN, EQ –0.3 3.8 V
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±3000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage 3 3.3 3.6 V
TA Operating free-air temperature [TUSB211] 0 70 °C
Operating free-air temperature [TUSB211I] –40 85

6.4 Thermal Information

THERMAL METRIC (1) RWB UNIT
12 PINS
RθJA Junction-to-ambient thermal resistance 161.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.3 °C/W
RθJB Junction-to-board thermal resistance 75.1 °C/W
ψJT Junction-to-top characterization parameter 1.9 °C/W
ψJB Junction-to-board characterization parameter 75.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
I(ACTIVE_HS) High Speed Active Current USB channel = HS mode. 480 Mbps traffic. VCC supply stable 16 20 mA
I(IDLE_HS) High Speed Idle Current USB channel = HS mode. No traffic. VCC supply stable 12 15 mA
I(SUSPEND_HS) Suspend Current USB channel = Suspend mode. 4.5 5.5 mA
I(FS) Full-Speed Current USB channel = FS mode 4.5 5.5 mA
I(LS) Low-Speed Current USB channel = LS mode 4.5 5.5 mA
I(DISCONN) Disconnect Power Host side application. No device attachment. 4.5 5.5 mA
I(RSTN) Disable Power RSTN driven low; VCC supply stable; VCC = 3.3 V 4.5 5.5 mA
RSTN
VIH High level input voltage 2 VCC V
VIL Low-level input voltage 0 0.8 V
IIH High level input current VIH = 3.6 V, VCC = 3 V, RPU enabled ±2 µA
IIL Low level input current VIL = 0V, VCC = 3.6 V, RPU enabled ±11 µA
EQ
R(EQ) External pulldown resistor Level 0 EQ 0.32 kΩ
Level 1 EQ 1.4 2.2 kΩ
Level 2 EQ [MAX] 3.7 4.1 kΩ
Level 3 EQ [MIN] 6 kΩ
CD, ENA_HS
VOH High level output voltage IO = –50 µA 2.4 V
VOL Low level output voltage IO = 50 µA 0.4 V
DxP, DxM
T(SHRT_GND) DP, DM low voltage short circuit DxP or DxM short circuited to GND continuously for 24 hours
at TA = 25°C only		 0 V
CIO(DXX) Capacitance to GND Measured with LCR meter and device powered down. 1 MHz sinusoid, 30 mVpp ripple 5 pF
(1) (1) All typical values are at VCC = 3.3 V, and TA = 25°C.

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
DxP, DxM
F(BR_DXX) Bit Rate USB channel = HS mode. 480 Mbps traffic. VCC supply stable 480 Mbps
t(R/F_DXX) Rise/Fall time 100 ps
CD, ENA_HS
t(EN) Enable time 20 µs
t(DIS) Disable time 20 µs
VCC
t(STABLE) VCC stable before RSTN de-assertion 100 µs
t(RAMP) VCC ramp time 0.2 100 ms
(1) (1) All typical values are at VCC = 3.3 V, and TA = 25°C.

 
Texas Instruments

© Copyright 1995-2025 Texas Instruments Incorporated. All rights reserved.
Submit documentation feedback | IMPORTANT NOTICE | Trademarks | Privacy policy | Cookie policy | Terms of use | Terms of sale