SLLSEZ6D February   2019  – December 2023 TUSB216

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High-Speed Boost
      2. 7.3.2 RX Sensitivity
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low-Speed (LS) Mode
      2. 7.4.2 Full-Speed (FS) Mode
      3. 7.4.3 High-Speed (HS) Mode
      4. 7.4.4 High-Speed Downstream Port Electrical Compliance Test Mode
      5. 7.4.5 Shutdown Mode
      6. 7.4.6 I2C Mode
      7. 7.4.7 BC 1.2 Battery Charging Controller
    5. 7.5 TUSB216 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Test Procedure to Construct USB High-speed Eye Diagram
          1. 8.2.2.1.1 For a Host Side Application
          2. 8.2.2.1.2 For a Device Side Application
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RWB|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision C (October 2020) to Revision D (December 2023)

  • Added extended temperature range part numberGo
  • Updated the Device Information table to include package lead frame sizeGo
  • Added Device Comparison sectionGo
  • Changed maximum recommended voltage for RX_SEN from 3.6 V to 5.0 VGo
  • Changed VIH(Max) for RX_SEN from 5.5 V to 5.0 V and removed resistors valuesGo
  • Added 400 kHz I2C supportGo
  • Added timing table for 400 kHz I2C Fast ModeGo
  • Added I2C standard and fast mode support in Detailed DescriptionGo
  • Corrected the footnote about limiting RX_SEN pin voltage to 5 V instead of BOOST pin to 3.6 VGo
  • Corrected NOTE about the recommended voltage for RX_SEN pin from max 3.6 V to 5 VGo

Changes from Revision B (January 2020) to Revision C (October 2020)

  • Changed to correct package type to RWB instead of RGYGo
  • Added a note to place an option to add a decoupling cap on CDP_ENZGo

Changes from Revision A (February 2019) to Revision B (January 2020)

  • Changed to correct typo from 100m to 10-m Go
  • Deleted automotive application to defer to future Q100 version Go