SLLSF89A September   2018  – December 2018 TUSB217-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High speed boost
      2. 7.3.2 RX Sensitivity
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Speed (LS) mode
      2. 7.4.2 Full Speed (FS) mode
      3. 7.4.3 High Speed (HS) mode
      4. 7.4.4 High Speed downstream port electrical compliance test mode
      5. 7.4.5 Shutdown mode
      6. 7.4.6 I2C mode
    5. 7.5 TUSB217 Registers
      1. 7.5.1 EDGE_BOOST Register (Offset = 0x1) [reset = X]
        1. Table 4. EDGE_BOOST Register Field Descriptions
      2. 7.5.2 CONFIGURATION Register (Offset = 0x3) [reset = X]
        1. Table 5. CONFIGURATION Register Field Descriptions
      3. 7.5.3 DC_BOOST Register (Offset = 0xE) [reset = X]
        1. Table 6. DC_BOOST Register Field Descriptions
      4. 7.5.4 RX_SEN Register (Offset = 0x25) [reset = X]
        1. Table 7. RX_SEN Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Test Procedure to Construct USB High Speed Eye Diagram
          1. 8.2.2.1.1 For a Host Side Application
          2. 8.2.2.1.2 For a Device Side Application
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGY|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1 Design Requirements

TUSB217-Q1 requires a valid reset signal as described in the power supply recommendations section. The capacitor at RSTN pin is not required if a micro controller drives the RSTN pin according to recommendations.

For this design example, use the parameters shown in Table 8, Table 9 and Table 10

Table 8. Design Parameters for 5 V Supply with High Loss System

PARAMETER VALUE(1)
VCC 5 V ±10%
I2C support required in system (Yes/No) No
Edge and DC Boost RBOOST BOOST Level Boost Level 1:
RBOOST = 1.8 kΩ
0-Ω 0
1.8 kΩ ±1% 1
3.6 kΩ ± 1% 2
Do Not Install (DNI) 3
RX Sensitivity RRXSEN1 RRXSEN2 RX_SEN Level High RX Sensitivity Level:
RRXSEN1 = 37 kΩ
RRXSEN2 = 47 kΩ
22 kΩ - 33 kΩ (27 kΩ typical) Do Not Install (DNI) Low
Do Not Install (DNI) Do Not Install (DNI) Medium
37 kΩ(2) 47 kΩ High
(1) These parameters are starting values for a high loss system. Further tuning might be required based on specific host and/or device as well as cable length and loss profile. These settings are not specific to a 5V supply system could be applicable to 3.3V supply system as well.
(2) This resistor is needed for a 5V supply to divide the voltage down so the BOOST pin voltage does not exceed 3.6V

Table 9. Design Parameters for 3.3 V Supply with Low to Medium Loss System

PARAMETER VALUE(1)
VCC 3.3 V ±10%
I2C support required in system (Yes/No) No
Edge and DC Boost RBOOST BOOST Level Boost Level 0:
RBOOST = 0-Ω
0-Ω 0
1.8 kΩ ±1% 1
3.6 kΩ ±1% 2
Do Not Install (DNI) 3
RX Sensitivity RRXSEN1 RRXSEN2 RX_SEN Level Medium RX Sensitivity Level:
RRXSEN1 = DNI
RRXSEN2 = DNI
22 kΩ - 33 kΩ (27 kΩ typical) Do Not Install (DNI) Low
Do Not Install (DNI) Do Not Install (DNI) Medium
Do Not Install (DNI) 22 kΩ - 33 kΩ (27 kΩ typical) High
(1) These parameters are starting values for a low to medium loss system. Further tuning might be required based on specific host and/or device as well as cable length and loss profile. These settings are not specific to a 3.3V supply system could be applicable to 5V supply system as well.

Table 10. Design Parameters for 2.3V - 4.3V VBAT Supply with Low to Medium Loss System

PARAMETER VALUE(1)
VCC 2.3 V to 4.3V
I2C support required in system (Yes/No) No
Edge and DC Boost RBOOST BOOST Level Boost Level 0:
RBOOST = 0-Ω
0-Ω 0
1.8 kΩ ±1% 1
3.6 kΩ ±1% 2
Do Not Install (DNI) 3
RX Sensitivity RRXSEN1 RRXSEN2 RX_SEN Level Medium RX Sensitivity Level:
RRXSEN1 = DNI
RRXSEN2 = DNI
22 kΩ - 33 kΩ (27 kΩ typical) Do Not Install (DNI) Low
Do Not Install (DNI) Do Not Install (DNI) Medium
37 kΩ(2) 10 kΩ High
(1) These parameters are starting values for a low to medium loss system. Further tuning might be required based on specific host and/or device as well as cable length and loss profile. These settings are not specific to a 2.3V-4.3V supply system could be applicable to 5V supply system as well.
(2) This resistor is needed for a VBAT supply (2.3V - 4.3V) to divide the voltage down so the BOOST pin voltage does not exceed 3.6V