SLLSF89A September   2018  – December 2018 TUSB217-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High speed boost
      2. 7.3.2 RX Sensitivity
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Speed (LS) mode
      2. 7.4.2 Full Speed (FS) mode
      3. 7.4.3 High Speed (HS) mode
      4. 7.4.4 High Speed downstream port electrical compliance test mode
      5. 7.4.5 Shutdown mode
      6. 7.4.6 I2C mode
    5. 7.5 TUSB217 Registers
      1. 7.5.1 EDGE_BOOST Register (Offset = 0x1) [reset = X]
        1. Table 4. EDGE_BOOST Register Field Descriptions
      2. 7.5.2 CONFIGURATION Register (Offset = 0x3) [reset = X]
        1. Table 5. CONFIGURATION Register Field Descriptions
      3. 7.5.3 DC_BOOST Register (Offset = 0xE) [reset = X]
        1. Table 6. DC_BOOST Register Field Descriptions
      4. 7.5.4 RX_SEN Register (Offset = 0x25) [reset = X]
        1. Table 7. RX_SEN Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Test Procedure to Construct USB High Speed Eye Diagram
          1. 8.2.2.1.1 For a Host Side Application
          2. 8.2.2.1.2 For a Device Side Application
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGY|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage 2.3 5 6.5 V
TA Operating free-air temperature (AEC-Q100) –40 105 °C
TJ Junction temperature (AEC-Q100) 115 °C
VI2C_BUS I2C Bus Voltage 1.62 3.6 V
DxP, DxM Voltage range USB data 0 3.6 V
BOOST Voltage range BOOST pin 0 1.98 V
SCL, SDA,  RX_SEN, RSTN Voltage range other pins (SCL, SDA,  RX_SEN, RSTN) 0 3.6 V