SLLSFK6 September   2021 TUSB217A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Timing Requirements
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High-Speed Boost
      2. 8.3.2 RX Sensitivity
    4. 8.4 Device Functional Modes
      1. 8.4.1 Low-Speed (LS) Mode
      2. 8.4.2 Full-Speed (FS) Mode
      3. 8.4.3 High-Speed (HS) Mode
      4. 8.4.4 High-Speed Downstream Port Electrical Compliance Test Mode
      5. 8.4.5 Shutdown Mode
      6. 8.4.6 I2C Mode
      7. 8.4.7 BC 1.2 Battery Charging Controller
    5. 8.5 TUSB217A-Q1 Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Test Procedure to Construct USB High-speed Eye Diagram
          1. 9.2.2.1.1 For a Host Side Application
          2. 9.2.2.1.2 For a Device Side Application
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC (1) RWB (X2QFN) UNIT
12 PINS
RθJA Junction-to-ambient thermal resistance 137.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62 °C/W
RθJB Junction-to-board thermal resistance 67.2 °C/W
ψJT Junction-to-top characterization parameter 1.9 °C/W
ψJB Junction-to-board characterization parameter 67.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.