SLLSFI4D November   2021  – April 2024 TUSB2E11

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Version Comparison
    1. 4.1 Device Variants
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1  Repeater Mode
      2. 8.4.2  Power Down Mode
      3. 8.4.3  Disabled Mode
      4. 8.4.4  UART Mode
      5. 8.4.5  Auto-Resume ECR
      6. 8.4.6  L2 State Interrupt Modes
      7. 8.4.7  Attach Detect Interrupt Mode
      8. 8.4.8  GPIO Mode
      9. 8.4.9  USB 2.0 High-Speed HOST Disconnect Detection
      10. 8.4.10 Frame Based Low Power Mode
      11. 8.4.11 Battery Charging
    5. 8.5 Manufacturing Test Modes
      1. 8.5.1 USB DP Test Procedure
      2. 8.5.2 USB DM Test Procedure
    6. 8.6 I2C Target Interface
  10. 9 Register Access Protocol (RAP)
  11. 10Register Map
    1. 10.1 TUSB2E11 Registers
  12. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 Power Supply Recommendations
      1. 11.3.1 Power Up Reset
    4. 11.4 Layout
      1. 11.4.1 Layout Guidelines
      2. 11.4.2 Example Layout for Application with 1.8V I2C Variant
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.2.2 Detailed Design Procedure

The best PHY setting is dependent upon the signal chain loss characteristics of the target platform. The recommendation is to start with lowest level of compensation for TX swing and pre-emphasis, and then increment until the optimal eye diagram margin is achieved. The same recommendation apply to the RX sensitivity or squelch threshold setting where TI recommends to adjust from low threshold until optimum RX sensitivity and squelch margins are achieved.

To optimize the TUSB2E11 RX equalization, monitor the corresponding TX eye diagram to achieve best RX EQ setting. In other words, to optimize eUSB2 RX equalization, monitor USB 2.0 TX eye and monitor eUSB2.0 TX eye to optimize USB RX equalization.

HS host disconnect threshold shall be adjusted to provide the most margin to avoid false disconnect as well as failure to detect a disconnect. See Table 8-2.

Note: The TUSB2E11 compensates for extra attenuation in the signal path according to the configuration of the TX and RX settings. General recommendation is to use just enough pre-emphasis and equalization to achieve eye margin and not over-equalize to avoid excessive jitter. Maximum PE width and slew rates are recommended.