SLLSFI4D November   2021  – April 2024 TUSB2E11

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Version Comparison
    1. 4.1 Device Variants
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1  Repeater Mode
      2. 8.4.2  Power Down Mode
      3. 8.4.3  Disabled Mode
      4. 8.4.4  UART Mode
      5. 8.4.5  Auto-Resume ECR
      6. 8.4.6  L2 State Interrupt Modes
      7. 8.4.7  Attach Detect Interrupt Mode
      8. 8.4.8  GPIO Mode
      9. 8.4.9  USB 2.0 High-Speed HOST Disconnect Detection
      10. 8.4.10 Frame Based Low Power Mode
      11. 8.4.11 Battery Charging
    5. 8.5 Manufacturing Test Modes
      1. 8.5.1 USB DP Test Procedure
      2. 8.5.2 USB DM Test Procedure
    6. 8.6 I2C Target Interface
  10. 9 Register Access Protocol (RAP)
  11. 10Register Map
    1. 10.1 TUSB2E11 Registers
  12. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 Power Supply Recommendations
      1. 11.3.1 Power Up Reset
    4. 11.4 Layout
      1. 11.4.1 Layout Guidelines
      2. 11.4.2 Example Layout for Application with 1.8V I2C Variant
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Device Version Comparison

Table 4-1 Device Register Comparison Table
Register Address B0 default B1 default
Table 10-5 0x70h 0x73h 0x7Ch
Table 10-6 0x71h 0x38h 0x3Ch
Table 10-7 0x72h 0x90h 0x92h
Table 10-8 0x73h 0x04h 0x83h
Table 10-9 0x77h 0x00h 0x00h
Table 10-10 0x78h 0x0Bh 0x0Bh
Table 10-11 0x79h 0x40h 0x60h
Table 10-12 0x50h 0x02h 0x02h
Table 10-13 0xB0h 0x02h 0x03h
Table 10-14 0xB2h 0x00h 0x00h
Table 10-15 0xB3h 0x00h 0x00h
Table 10-16 0xB4h 0x00h 0x00h
Table 10-18 0xB6h 0xC0h 0xC0h
Table 10-22 0x60h 0x00h 0x00h
Table 10-23 0xF5h 0x32h 0x32h
Table 4-2 Device Feature Comparison Table
Features B0 B1
Low Power Mode (RESETB = low) not supported supported (9 µW)
Auto-resume ECR not supported supported (enabled by default) [see register 0x78h]
L2 State Interrupt Resume supported supported