SLLSFI4D November   2021  – April 2024 TUSB2E11

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Version Comparison
    1. 4.1 Device Variants
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1  Repeater Mode
      2. 8.4.2  Power Down Mode
      3. 8.4.3  Disabled Mode
      4. 8.4.4  UART Mode
      5. 8.4.5  Auto-Resume ECR
      6. 8.4.6  L2 State Interrupt Modes
      7. 8.4.7  Attach Detect Interrupt Mode
      8. 8.4.8  GPIO Mode
      9. 8.4.9  USB 2.0 High-Speed HOST Disconnect Detection
      10. 8.4.10 Frame Based Low Power Mode
      11. 8.4.11 Battery Charging
    5. 8.5 Manufacturing Test Modes
      1. 8.5.1 USB DP Test Procedure
      2. 8.5.2 USB DM Test Procedure
    6. 8.6 I2C Target Interface
  10. 9 Register Access Protocol (RAP)
  11. 10Register Map
    1. 10.1 TUSB2E11 Registers
  12. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 Power Supply Recommendations
      1. 11.3.1 Power Up Reset
    4. 11.4 Layout
      1. 11.4.1 Layout Guidelines
      2. 11.4.2 Example Layout for Application with 1.8V I2C Variant
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
USB (DP, DN), HS Driver Switching Characteristics
THSR Rise time (10% – 90%) Data Signal Rise and Fall, Eye Patterns(1), U_HS_TX_SLEW_RATE_Px setting 11, ideal 45 Ω to GND loads on DP and DN, pre-emphasis disabled. 530 625 740 ps
THSF Fall time (10% – 90%) Data Signal Rise and Fall, Eye Patterns, U_HS_TX_SLEW_RATE_Px setting 11, ideal 45 Ω to GND loads on DP and DN, pre-emphasis disabled. 530 625 740 ps
USB (DP, DN), FS Driver Switching Characteristics
TFR Rise time (10% – 90%) Data Signal Rise and Fall Time and Full-speed Load(1) 4 20 ns
TFF Fall time (10% – 90%) Data Signal Rise and Fall Time and Full-speed Load(1) 4 20 ns
TFRFM (TFR/TFM) Data Signal Rise and Fall, Eye Patterns(1), excluding the first transition from the Idle state 90 111.1 %
USB (DP, DN), LS Driver Switching Characteristics
TLR Rise time (10% – 90%) Data Signal Rise and Fall Time and Full-speed Load(1) 75 300 ns
TLF Fall time (10% – 90%) Data Signal Rise and Fall Time and Full-speed Load(1) 75 300 ns
eUSB2 (eDP, eDN), HS Driver Switching Characteristics
TEHSRF Rise/fall time (20% – 80%)  Full-Speed/Low-Speed Electrical Specification(2), ideal 80 Ω Rx differential termination E_HS_TX_SLEW_RATE_Px setting = 01 355 440 525 ps
TEHSRF_MM Transmit rise/fall mismatch Full-Speed/Low-Speed Electrical Specification(2), 
rise/fall mismatch = absolute delta of (rise – fall time) / (average of rise and fall time).		 25 %
eUSB2 (eDP, eDN), LS/FS Driver Switching Characteristics
TERF Rise/fall time (10% – 90%)  Low-Speed /Full-Speed DC Specifications for 1.2 V ± 10%(2) 2 6 ns
TERF_MM Transmit rise/fall mismatch Low-Speed /Full-Speed DC Specifications for 1.2 V ± 10%(2) 25 %
I2C (SDA)
Tr Rise time (STD) Bus Speed = 100 kHz, CL= 200 pF, RPU = 4 kΩ, IOL ≅ 1 mA 600 ns
Tr Rise time (FM) Bus Speed = 400 kHz, CL= 200 pF, RPU = 2.2 kΩ, IOL ≅ 2 mA 180 ns
Tr Rise time (FM+) Bus Speed = 1 MHz, CL= 10 pF, RPU = 1 kΩ, IOL ≅ 4 mA 72 ns
Tr Rise time (STD) Bus Speed = 100 kHz, CL= 200 pF, RPU = 4 kΩ, IOL ≅ 2 mA 1000 ns
Tr Rise time (FM) Bus Speed = 400 kHz, CL= 200 pF, RPU = 1 kΩ, IOL ≅ 8 mA 300 ns
Tr Rise time (FM+) Bus Speed = 1 MHz, CL= 50 pF, RPU = 1 kΩ, IOL ≅ 4 mA 120 ns
Tf Fall time (STD) Bus Speed = 100 kHz, CL= 200 pF, RPU = 2.2 kΩ, IOL ≅ 4 mA 106.5 ns
Tf Fall time (FM) Bus Speed = 400 kHz, CL= 200 pF, RPU = 1 kΩ, IOL ≅ 8 mA 106.5 ns
Tf Fall time (FM+) Bus Speed = 1 MHz, CL= 90 pF, RPU = 1 kΩ, IOL ≅ 8 mA 81.5 ns
Tf Fall time (STD) Bus Speed = 100 kHz, CL= 10 pF, RPU = 4 kΩ, , IOL ≅ 2 mA 6.5 ns
Tf Fall time (FM) Bus Speed = 400 kHz, CL= 10 pF, RPU = 2.2 kΩ, IOL ≅ 4 mA 6.5 ns
Tf Fall time (FM+) Bus Speed = 1 MHz, CL= 10 pF, RPU = 1 kΩ, IOL ≅ 8 mA 6.5 ns
(1) USB 2.0 Promoter Group 2000, USB 2.0 Specification USB 2.0 Promoter Group
(2) USB Implementers Forum (2018). Embedded USB2 (eUSB2) Physical Layer Supplement to the USB Revision 2.0 Specification, Rev. 1.2 USB Implementers Forum