SNLS648C February   2019  – August 2024 TUSB2E22

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Requirements
  7. 6 Parametric Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 USB 2.0
      2. 7.3.2 eUSB2
      3. 7.3.3 Cross MUX
    4. 7.4 Device Functional Modes
      1. 7.4.1 Repeater Mode
      2. 7.4.2 Power Down Mode
      3. 7.4.3 CROSS
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Dual Port System Implementation
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Up Reset
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Example YCG Layout For Application With No Cross MUX Function.
      3. 8.4.3 Example RZA Layout For Application With No Cross MUX Function
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RZA|20
  • YCG|25
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TUSB2E22 TUSB2E22 UNIT
YCG (DSBGA) RZA (VQFN)
25 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 73.5 46.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.4 39.0 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance — 13.2 °C/W
RθJB Junction-to-board thermal resistance 18.9 21.3 °C/W
ΨJT Junction-to-top characterization parameter 0.2 1.6 °C/W
ΨJB Junction-to-board characterization parameter 18.9 21.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.