SNLS757B June   2024  – November 2024 TUSB2E221

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Variants
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. 7 Parametric Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 USB 2.0
      2. 8.3.2 eUSB2
      3. 8.3.3 Cross MUX
    4. 8.4 Device Functional Modes
      1. 8.4.1  Repeater Mode
      2. 8.4.2  Power-Down Mode
      3. 8.4.3  UART Mode
      4. 8.4.4  Auto-Resume ECR
      5. 8.4.5  L2 State Interrupt Modes
      6. 8.4.6  Attach Detect Interrupt Mode
      7. 8.4.7  GPIO Mode
        1. 8.4.7.1 EQ0 as GPIO0
        2. 8.4.7.2 EQ1 as GPIO1
        3. 8.4.7.3 EQ2/INT as GPIO2
      8. 8.4.8  CROSS
      9. 8.4.9  USB 2.0 High-Speed HOST Disconnect Detection
      10. 8.4.10 Frame Based Low Power Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Target Interface
      2. 8.5.2 Register Access Protocol (RAP)
  10. 9 Register Map
    1. 9.1 TUSB2E221 Registers
  11. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application: Dual Port System
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 eUSB PHY Settings Recommendation
      3. 10.2.3 Application Curve
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Power-Up Reset
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Example Layout
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Revision History

Changes from Revision A (October 2024) to Revision B (November 2024)

  • Added RAP address for writesGo

Changes from Revision * (June 2024) to Revision A (October 2024)

  • Changed data sheet status from: Advanced Information to: Production MixedGo
  • Changed YCG (DSBGA, 25) package status from: preview to: activeGo