SLLSEO6C June   2015  – August 2018 TUSB321

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Sample Applications
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Cables, Adapters, and Direct Connect Devices
        1. 7.1.1.1 USB Type-C Receptacles and Plugs
        2. 7.1.1.2 USB Type-C Cables
        3. 7.1.1.3 Legacy Cables and Adapters
        4. 7.1.1.4 Direct Connect Devices
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Port Role Configuration
        1. 7.3.1.1 Downstream Facing Port (DFP) - Source
        2. 7.3.1.2 Upstream Facing Port (UFP) - Sink
        3. 7.3.1.3 Dual Role Port (DRP)
      2. 7.3.2 Type-C Current Mode
      3. 7.3.3 VBUS Detection
      4. 7.3.4 Cable Orientation and External MUX Control
      5. 7.3.5 VCONN Support for Active Cables
    4. 7.4 Device Functional Modes
      1. 7.4.1 Unattached Mode
      2. 7.4.2 Active Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DFP Mode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.