SLLSEO5C October   2015  – May 2017 TUSB322I

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Cables, Adapters, and Direct Connect Devices
        1. 7.3.1.1 USB Type-C Receptacles and Plugs
        2. 7.3.1.2 USB Type-C Cables
        3. 7.3.1.3 Legacy Cables and Adapters
        4. 7.3.1.4 Direct Connect Devices
        5. 7.3.1.5 Audio Adapters
      2. 7.3.2 Port Role Configuration
        1. 7.3.2.1 Downstream Facing Port (DFP) - Source
        2. 7.3.2.2 Upstream Facing Port (UFP) - Sink
        3. 7.3.2.3 Dual Role Port (DRP)
      3. 7.3.3 Type-C Current Mode
      4. 7.3.4 Accessory Support
        1. 7.3.4.1 Audio Accessory
        2. 7.3.4.2 Debug Accessory
      5. 7.3.5 I2C and GPIO Control
      6. 7.3.6 VBUS Detection
      7. 7.3.7 Cable Orientation and External MUX Control
      8. 7.3.8 VCONN Support for Active Cables
    4. 7.4 Device Functional Modes
      1. 7.4.1 Unattached Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Shutdown Mode
      4. 7.4.4 Dead Battery Mode
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1 CSR Registers
        1. 7.6.1.1 Device Identification Register (offset = 0x07 through 0x00) [reset = 0x00, 0x54, 0x55, 0x53, 0x42, 0x33, 0x32, 0x32]
        2. 7.6.1.2 Connection Status Register (offset = 0x08) [reset = 0x00]
        3. 7.6.1.3 Connection Status and Control Register (offset = 0x09) [reset = 0x20]
        4. 7.6.1.4 General Control Register (offset = 0x0A) [reset = 0x00]
        5. 7.6.1.5 Device Revision Register (offset = 0xA0) [reset = 0x02]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DRP in I2C Mode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DFP in I2C Mode
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 UFP in I2C Mode
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

  • Semiconductor and C Package Thermal Metrics application report, SPRA953

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

USB Type-C is a trademark of USB Implementers Forum.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.