SLLSEO5D October   2015  – March 2021 TUSB322I

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Cables, Adapters, and Direct Connect Devices
        1. 6.3.1.1 USB Type-C Receptacles and Plugs
        2. 6.3.1.2 USB Type-C Cables
        3. 6.3.1.3 Legacy Cables and Adapters
        4. 6.3.1.4 Direct Connect Devices
        5. 6.3.1.5 Audio Adapters
      2. 6.3.2 Port Role Configuration
        1. 6.3.2.1 Downstream Facing Port (DFP) - Source
        2. 6.3.2.2 Upstream Facing Port (UFP) - Sink
        3. 6.3.2.3 Dual Role Port (DRP)
      3. 6.3.3 Type-C Current Mode
      4. 6.3.4 Accessory Support
        1. 6.3.4.1 Audio Accessory
        2. 6.3.4.2 Debug Accessory
      5. 6.3.5 I2C and GPIO Control
      6. 6.3.6 VBUS Detection
      7. 6.3.7 Cable Orientation and External MUX Control
      8. 6.3.8 VCONN Support for Active Cables
    4. 6.4 Device Functional Modes
      1. 6.4.1 Unattached Mode
      2. 6.4.2 Active Mode
      3. 6.4.3 Shutdown Mode
      4. 6.4.4 Dead Battery Mode
    5. 6.5 Programming
    6. 6.6 Register Maps
      1. 6.6.1 CSR Registers
        1. 6.6.1.1 Device Identification Register (offset = 0x07 through 0x00) [reset = 0x00, 0x54, 0x55, 0x53, 0x42, 0x33, 0x32, 0x32]
        2. 6.6.1.2 Connection Status Register (offset = 0x08) [reset = 0x00]
        3. 6.6.1.3 Connection Status and Control Register (offset = 0x09) [reset = 0x20]
        4. 6.6.1.4 General Control Register (offset = 0x0A) [reset = 0x00]
        5. 6.6.1.5 Device Revision Register (offset = 0xA0) [reset = 0x02]
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 DRP in I2C Mode
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 DFP in I2C Mode
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
      3. 7.2.3 UFP in I2C Mode
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
        3. 7.2.3.3 Application Curves
    3. 7.3 Initialization Set Up
  8. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Community Resources
    4. 9.4 Trademarks
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated