SLLSEO5C October   2015  – May 2017 TUSB322I

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Cables, Adapters, and Direct Connect Devices
        1. 7.3.1.1 USB Type-C Receptacles and Plugs
        2. 7.3.1.2 USB Type-C Cables
        3. 7.3.1.3 Legacy Cables and Adapters
        4. 7.3.1.4 Direct Connect Devices
        5. 7.3.1.5 Audio Adapters
      2. 7.3.2 Port Role Configuration
        1. 7.3.2.1 Downstream Facing Port (DFP) - Source
        2. 7.3.2.2 Upstream Facing Port (UFP) - Sink
        3. 7.3.2.3 Dual Role Port (DRP)
      3. 7.3.3 Type-C Current Mode
      4. 7.3.4 Accessory Support
        1. 7.3.4.1 Audio Accessory
        2. 7.3.4.2 Debug Accessory
      5. 7.3.5 I2C and GPIO Control
      6. 7.3.6 VBUS Detection
      7. 7.3.7 Cable Orientation and External MUX Control
      8. 7.3.8 VCONN Support for Active Cables
    4. 7.4 Device Functional Modes
      1. 7.4.1 Unattached Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Shutdown Mode
      4. 7.4.4 Dead Battery Mode
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1 CSR Registers
        1. 7.6.1.1 Device Identification Register (offset = 0x07 through 0x00) [reset = 0x00, 0x54, 0x55, 0x53, 0x42, 0x33, 0x32, 0x32]
        2. 7.6.1.2 Connection Status Register (offset = 0x08) [reset = 0x00]
        3. 7.6.1.3 Connection Status and Control Register (offset = 0x09) [reset = 0x20]
        4. 7.6.1.4 General Control Register (offset = 0x0A) [reset = 0x00]
        5. 7.6.1.5 Device Revision Register (offset = 0xA0) [reset = 0x02]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DRP in I2C Mode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DFP in I2C Mode
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 UFP in I2C Mode
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

  1. An extra trace (or stub) is created when connecting between more than two points. A trace connecting pin A6 to pin B6 will create a stub because the trace also has to go to the USB Host. Ensure that:
    • A stub created by short on pin A6 (DP) and pin B6 (DP) at Type-C receptacle does not exceed 3.5 mm.
    • A stub created by short on pin A7 (DM) and pin B7 (DM) at Type-C receptacle does not exceed 3.5 mm.
  2. A 100-nF capacitor should be placed as close as possible to the TUSB322I VDD pin.

10.2 Layout Example

TUSB322I layout_sllsen9_320_sllseo5_322.gif Figure 14. TUSB322I Layout