SLLSEI1C July   2015  – July 2024 TUSB4020BI-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 3.3V I/O Electrical Characteristics
    6. 5.6 Hub Input Supply Current
    7. 5.7 Power-Up Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Battery Charging Features
      2. 6.3.2 USB Power Management
      3. 6.3.3 Clock Generation
      4. 6.3.4 Power-Up and Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 External Configuration Interface
    5. 6.5 Programming
      1. 6.5.1 One-Time Programmable (OTP) Configuration
      2. 6.5.2 I2C EEPROM Operation
      3. 6.5.3 SMBus Target Operation
    6. 6.6 Register Maps
      1. 6.6.1 Configuration Registers
        1. 6.6.1.1  ROM Signature Register (offset = 0h) [reset = 0h]
        2. 6.6.1.2  Vendor ID LSB Register (offset = 1h) [reset = 51h]
        3. 6.6.1.3  Vendor ID MSB Register (offset = 2h) [reset = 4h]
        4. 6.6.1.4  Product ID LSB Register (offset = 3h) [reset = 25h]
        5. 6.6.1.5  Product ID MSB Register (offset = 4h) [reset = 80h]
        6. 6.6.1.6  Device Configuration Register (offset = 5h) [reset = 1Xh]
        7. 6.6.1.7  Battery Charging Support Register (offset = 6h) [reset = 0Xh]
        8. 6.6.1.8  Device Removable Configuration Register (offset = 7h) [reset = 0Xh]
        9. 6.6.1.9  Port Used Configuration Register (offset = 8h) [reset = 0h]
        10. 6.6.1.10 PHY Custom Configuration Register (offset = 9h) [reset = 0h]
        11. 6.6.1.11 Device Configuration Register 2 (offset = Ah)
        12. 6.6.1.12 UUID Registers (offset = 10h to 1Fh)
        13. 6.6.1.13 Language ID LSB Register (offset = 20h)
        14. 6.6.1.14 Language ID MSB Register (offset = 21h)
        15. 6.6.1.15 Serial Number String Length Register (offset = 22h)
        16. 6.6.1.16 Manufacturer String Length Register (offset = 23h)
        17. 6.6.1.17 Product String Length Register (offset = 24h)
        18. 6.6.1.18 Serial Number Registers (offset = 30h to 4Fh)
        19. 6.6.1.19 Manufacturer String Registers (offset = 50h to 8Fh)
        20. 6.6.1.20 Product String Registers (offset = 90h to CFh)
        21. 6.6.1.21 Additional Feature Configuration Register (offset = F0h)
        22. 6.6.1.22 Charging Port Control Register (offset = F2h)
        23. 6.6.1.23 Device Status and Command Register (offset = F8h)
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Crystal Requirements
      2. 7.1.2 Input Clock Requirements
    2. 7.2 Typical Applications
      1. 7.2.1 Upstream Port Implementation
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Downstream Port 1 Implementation
      3. 7.2.3 Downstream Port 2 Implementation
      4. 7.2.4 VBUS Power Switch Implementation
      5. 7.2.5 Clock, Reset, and Miscellaneous
      6. 7.2.6 Power Implementation
  9. 8 Power Supply Recommendations
    1. 8.1 Power Supply
    2. 8.2 Downstream Port Power
    3. 8.3 Ground
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Placement
      2. 9.1.2 Package Specific
      3. 9.1.3 Differential Pairs
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Power-Up Timing Requirements

MINNOMMAXUNIT
td1VDD33 stable before VDD stable(1)see (2)ms
td2VDD and VDD33 stable before deassertion of GRSTz3ms
tsu_ioSetup for MISC inputs(3) sampled at the deassertion of GRSTz0.1µs
thd_ioHold for MISC inputs(3) sampled at the deassertion of GRSTz.0.1µs
tVDD33_RAMPVDD33 supply ramp requirements0.2100ms
tVDD_RAMPVDD supply ramp requirements0.2100ms
(1) An active reset is required if the VDD33 supply is stable before the VDD11 supply. This active Reset shall meet the 3ms power-up delay counting from both power supplies being stable to the deassertion of GRSTz.
(2) There is no power-on relationship between VDD33 and VDD unless GRSTz is only connected to a capacitor to GND. Then VDD must be stable minimum of 10 μs before the VDD33.
(3) MISC pins sampled at deassertion of GRSTz: FULLPWRMGMTz, GANGED, PWRCTL_POL, SMBUSz, BATEN[4:1], and AUTOENz.
TUSB4020BI-Q1 Power-Up Timing RequirementsFigure 5-1 Power-Up Timing Requirements