SLLSEW6C November 2016 – June 2018 TUSB422
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TUSB422 | UNIT | |
---|---|---|---|
YFF (DSBGA) | |||
9 PINS | |||
RΘJA | Junction-to-ambient thermal resistance | 114.3 | °C/W |
RΘJC(top) | Junction-to-case (top) thermal resistance | 0.7 | °C/W |
RΘJB | Junction-to-board thermal resistance | 24.9 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 24.9 | °C/W |
RΘJC(bot) | Junction-to-case (bottom) thermal resistance | NA | °C/W |