SLLSFP1A May   2024  – September 2024 TUSB521-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 USB 3.2
      2. 7.3.2 4-Level Inputs
      3. 7.3.3 Receiver Linear Equalization
    4. 7.4 Device Functional Modes
      1. 7.4.1 USB 3.2 2:1 MUX Description
      2. 7.4.2 Linear EQ Configuration
      3. 7.4.3 USB3.2 Modes
      4. 7.4.4 Operation Timing – Power Up
    5. 7.5 Programming
      1. 7.5.1 TUSB521-Q1 I2C Target Behavior
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 USB SSTX1/2 Receiver Configuration
        2. 8.2.2.2 USB RX1/2 Receiver Configuration
        3. 8.2.2.3 ESD Protection
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Register Maps
    1. 9.1 General Register (address = 0x0A) [reset = 00000001]
    2. 9.2 USB3.2 Control/Status Registers (address = 0x20) [reset = 00000000]
    3. 9.3 USB3.2 Control/Status Registers (address = 0x21) [reset = 00000000]
    4. 9.4 USB3.2 Control/Status Registers (address = 0x22) [reset = 00000000]
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application Curve

TUSB521-Q1 Insertion Loss of FR4 PCB Traces
Figure 8-3 Insertion Loss of FR4 PCB Traces