SLLSFP1A May   2024  – September 2024 TUSB521-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 USB 3.2
      2. 7.3.2 4-Level Inputs
      3. 7.3.3 Receiver Linear Equalization
    4. 7.4 Device Functional Modes
      1. 7.4.1 USB 3.2 2:1 MUX Description
      2. 7.4.2 Linear EQ Configuration
      3. 7.4.3 USB3.2 Modes
      4. 7.4.4 Operation Timing – Power Up
    5. 7.5 Programming
      1. 7.5.1 TUSB521-Q1 I2C Target Behavior
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 USB SSTX1/2 Receiver Configuration
        2. 8.2.2.2 USB RX1/2 Receiver Configuration
        3. 8.2.2.3 ESD Protection
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Register Maps
    1. 9.1 General Register (address = 0x0A) [reset = 00000001]
    2. 9.2 USB3.2 Control/Status Registers (address = 0x20) [reset = 00000000]
    3. 9.3 USB3.2 Control/Status Registers (address = 0x21) [reset = 00000000]
    4. 9.4 USB3.2 Control/Status Registers (address = 0x22) [reset = 00000000]
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Timing Requirements

MIN NOM MAX UNIT
USB3
tIDLEEntry, Delay from U0 to electrical idle 10 ns
tIDLEExit_U1 U1 exit time: break in electrical idle to the transmission of LFPS 6 ns
tIDLEExit_U2U3 U2/U3 exit time: break in electrical idle to transmission of LFPS 10 µs
tRXDET_INTVL RX detect interval while in disconnect 12 ms
tIDLEExit_DISC Disconnect exit time 10 µs
tExit_SHTDN Shutdown exit time (CTL0 = VCC/2 to U2/U3) 1 ms
tDIFF_DLY Differential propagation delay (20% to 80% of differential voltage measured 1.7 inch from the output pin) 300 ps
tPWRUPACTIVE Time when Vcc reaches 70% to device active 1 ms
tR, tF Output rise/fall time 40 ps
tRF-MM Output rise/fall time mismatch (20% to 80% of differential voltage measured 1.7 inch from the output pin) 5 ps