SLLSEV9E July   2016  – November 2023 TUSB522P

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, Power Supply
    6. 6.6 Electrical Characteristics, DC
    7. 6.7 Electrical Characteristics, AC
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Receiver Equalization
      2. 7.3.2 De-Emphasis Control and Output Swing
      3. 7.3.3 Automatic LFPS Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Configuration
      2. 7.4.2 Power Modes
        1. 7.4.2.1 U0 Mode (Active Power Mode)
        2. 7.4.2.2 U2/U3 (Low Power Mode)
        3. 7.4.2.3 Disconnect Mode - RX Detect
        4. 7.4.2.4 Shutdown Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ESD Protection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 Typical Application

GUID-20230927-SS0I-M73C-WPVF-PZHC9PHQHMLT-low.svg Figure 8-1 Embedded Host Application

The CAC-USB1 and CAC-USB2 should be placed between ESD and USB receptacle for systems designing for short to VBUS protection.