SLLSEV9E July   2016  – November 2023 TUSB522P

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, Power Supply
    6. 6.6 Electrical Characteristics, DC
    7. 6.7 Electrical Characteristics, AC
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Receiver Equalization
      2. 7.3.2 De-Emphasis Control and Output Swing
      3. 7.3.3 Automatic LFPS Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Configuration
      2. 7.4.2 Power Modes
        1. 7.4.2.1 U0 Mode (Active Power Mode)
        2. 7.4.2.2 U2/U3 (Low Power Mode)
        3. 7.4.2.3 Disconnect Mode - RX Detect
        4. 7.4.2.4 Shutdown Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ESD Protection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (May 2019) to Revision E (November 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Updated the Device Information table to include ambient temperature Go
  • In the Pin Functions table deleted "Note: When OS = low." for both DE1 and DE2. Go
  • In Recommended Operation Conditions, changed CAC-USB1 max from 200 nF to 265 nF.Go
  • Reformat Table 7-1 for readability.Go
  • Updated Figure 8-1 to include CAC-USB1, CAC-USB2, LAB, LCD, LAC-CAP, LESD, RESD, and RRX, Go
  • Added comment that ac-capacitor should be placed between ESD and USB receptacle when designing for short to VBUS protection.Go
  • Updated the Design Parameters table to include pre-channel and post-channel min/max limitsGo
  • Added the ESD Protection sectionGo

Changes from Revision C (May 2019) to Revision D (May 2019)

  • Changed pin 11 From: TX1N To: TX2N and pin 12 From: TX1P To: TX2P in Figure 8-2Go

Changes from Revision B (November 2017) to Revision C (May 2019)

  • Deleted the RGE0024F mechanical pagesGo

Changes from Revision A (October 2016) to Revision B (November 2017)

  • Changed the values in the FOR OS = HIGH column of Table 7-1 to match FOR OS = LOW column. Go

Changes from Revision * (July 2016) to Revision A (October 2016)

  • Changed the device From Preview To: ProductionGo