SLLSEZ0E April   2017  – April 2018 TUSB544

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Characteristics
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 USB 3.1
      2. 7.3.2 DisplayPort
      3. 7.3.3 4-Level Inputs
      4. 7.3.4 Receiver Linear Equalization
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Configuration in GPIO Mode
      2. 7.4.2 Device Configuration in I2C Mode
      3. 7.4.3 DisplayPort Mode
      4. 7.4.4 Custom Alternate Mode
      5. 7.4.5 Linear EQ Configuration
      6. 7.4.6 Adjustable VOD Linear Range and DC Gain
      7. 7.4.7 USB3.1 modes
      8. 7.4.8 Operation Timing – Power Up
    5. 7.5 Programming
      1. 7.5.1 The Following Procedure Should be Followed to Write to TUSB544 I2C Registers:
      2. 7.5.2 The Following Procedure Should be Followed to Read the TUSB544 I2C Registers:
      3. 7.5.3 The Following Procedure Should be Followed for Setting a Starting Sub-Address for I2C Reads:
    6. 7.6 Register Maps
      1. 7.6.1 TUSB544 Registers
        1. 7.6.1.1  GENERAL_4 Register (Offset = Ah) [reset = 1h]
          1. Table 13. GENERAL_4 Register Field Descriptions
        2. 7.6.1.2  GENERAL_5 Register (Offset = Bh) [reset = 0h]
          1. Table 14. GENERAL_5 Register Field Descriptions
        3. 7.6.1.3  GENERAL_6 Register (Offset = Ch) [reset = 0h]
          1. Table 15. GENERAL_6 Register Field Descriptions
        4. 7.6.1.4  DISPLAYPORT_1 Register (Offset = 10h) [reset = 0h]
          1. Table 16. DISPLAYPORT Register Field Descriptions
        5. 7.6.1.5  DISPLAYPORT_2 Register (Offset = 11h) [reset = 0h]
          1. Table 17. DISPLAYPORT_2 Register Field Descriptions
        6. 7.6.1.6  DISPLAYPORT_3 Register (Offset = 12h) [reset = 0h]
          1. Table 18. DISPLAYPORT_3 Register Field Descriptions
        7. 7.6.1.7  DISPLAYPORT_4 Register (Offset = 13h) [reset = 0h]
          1. Table 19. DISPLAYPORT_4 Register Field Descriptions
        8. 7.6.1.8  DISPLAYPORT_5 Register (Offset = 1Bh) [reset = 0h]
          1. Table 20. DISPLAYPORT_5 Register Field Descriptions
        9. 7.6.1.9  USB3.1_1 Register (Offset = 20h) [reset = 0h]
          1. Table 21. USB3.1 Register Field Descriptions
        10. 7.6.1.10 USB3.1_2 Register (Offset = 21h) [reset = 0h]
          1. Table 22. USB3.1_2 Register Field Descriptions
        11. 7.6.1.11 USB3.1_3 Register (Offset = 22h) [reset = 0h]
          1. Table 23. USB3.1_3 Register Field Descriptions
        12. 7.6.1.12 USB3.1_4 Register (Offset = 23h) [reset = 23h]
          1. Table 24. USB3.1_4 Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 USB 3.1 only (USB/DP Alternate Mode)
      2. 8.3.2 USB3.1 and 2 lanes of DisplayPort
      3. 8.3.3 DisplayPort Only
      4. 8.3.4 USB 3.1 only (USB/Custom Alternate Mode)
      5. 8.3.5 USB3.1 and 1 Lane of Custom Alt Mode
      6. 8.3.6 USB3.1 and 2 Lane of Custom Alt Mode
      7. 8.3.7 USB3.1 and 4 Lane of Custom Alt Mode
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 DC Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
4-State CMOS Inputs(UEQ[1:0];DEQ[1:0], CFG[1:0], A[1:0], I2C_EN, VIO_SEL)
IIH High level input current VCC = 3.6 VIN = 3.6 V 20 80 µA
IIL Low level input current VCC = 3.6 V; VIN = 0 V –160 –40 µA
4-Level VTH Threshold 0 / R VCC = 3.3 V 0.55 V
Threshold R/ Float VCC = 3.3 V 1.65 V
Threshold Float / 1 VCC = 3.3 V 2.7 V
RPU Internal pull-up resistance 35 kΩ
RPD Internal pull-down resistance 95 kΩ
2-State CMOS Input (CTL0, CTL1, FLIP, HPDIN, SLP_S0#, SWAP, DIR[1:0]).
VIH High-level input voltage 0.7×VIO 3.6 V
VIL Low-level input voltage 0 0.3×VIO V
RPD Internal pull-down resistance for CTL1 500 kΩ
IIH High-level input current VIN = 3.6 V –25 25 µA
IIL Low-level input current VIN = GND, VCC = 3.6 V –25 25 µA
I2C Control Pins SCL, SDA
VIH High-level input voltage I2C_EN = 0 0.7 x VI2C 3.6 V
VIL Low-level input voltage I2C_EN = 0 0 0.3 x VI2C V
VOL Low-level output voltage I2C_EN = 0; IOL = 3 mA 0 0.4 V
IOL Low-level output current I2C_EN = 0; VOL = 0.4 V 20 mA
II_I2C Input current on SDA pin 0.1 x VI2C< Input voltage < 3.3 V –10 10 µA
CI_I2C Input capacitance 0.5 10 pF