SLLSEZ0E April   2017  – April 2018 TUSB544

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Characteristics
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 USB 3.1
      2. 7.3.2 DisplayPort
      3. 7.3.3 4-Level Inputs
      4. 7.3.4 Receiver Linear Equalization
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Configuration in GPIO Mode
      2. 7.4.2 Device Configuration in I2C Mode
      3. 7.4.3 DisplayPort Mode
      4. 7.4.4 Custom Alternate Mode
      5. 7.4.5 Linear EQ Configuration
      6. 7.4.6 Adjustable VOD Linear Range and DC Gain
      7. 7.4.7 USB3.1 modes
      8. 7.4.8 Operation Timing – Power Up
    5. 7.5 Programming
      1. 7.5.1 The Following Procedure Should be Followed to Write to TUSB544 I2C Registers:
      2. 7.5.2 The Following Procedure Should be Followed to Read the TUSB544 I2C Registers:
      3. 7.5.3 The Following Procedure Should be Followed for Setting a Starting Sub-Address for I2C Reads:
    6. 7.6 Register Maps
      1. 7.6.1 TUSB544 Registers
        1. 7.6.1.1  GENERAL_4 Register (Offset = Ah) [reset = 1h]
          1. Table 13. GENERAL_4 Register Field Descriptions
        2. 7.6.1.2  GENERAL_5 Register (Offset = Bh) [reset = 0h]
          1. Table 14. GENERAL_5 Register Field Descriptions
        3. 7.6.1.3  GENERAL_6 Register (Offset = Ch) [reset = 0h]
          1. Table 15. GENERAL_6 Register Field Descriptions
        4. 7.6.1.4  DISPLAYPORT_1 Register (Offset = 10h) [reset = 0h]
          1. Table 16. DISPLAYPORT Register Field Descriptions
        5. 7.6.1.5  DISPLAYPORT_2 Register (Offset = 11h) [reset = 0h]
          1. Table 17. DISPLAYPORT_2 Register Field Descriptions
        6. 7.6.1.6  DISPLAYPORT_3 Register (Offset = 12h) [reset = 0h]
          1. Table 18. DISPLAYPORT_3 Register Field Descriptions
        7. 7.6.1.7  DISPLAYPORT_4 Register (Offset = 13h) [reset = 0h]
          1. Table 19. DISPLAYPORT_4 Register Field Descriptions
        8. 7.6.1.8  DISPLAYPORT_5 Register (Offset = 1Bh) [reset = 0h]
          1. Table 20. DISPLAYPORT_5 Register Field Descriptions
        9. 7.6.1.9  USB3.1_1 Register (Offset = 20h) [reset = 0h]
          1. Table 21. USB3.1 Register Field Descriptions
        10. 7.6.1.10 USB3.1_2 Register (Offset = 21h) [reset = 0h]
          1. Table 22. USB3.1_2 Register Field Descriptions
        11. 7.6.1.11 USB3.1_3 Register (Offset = 22h) [reset = 0h]
          1. Table 23. USB3.1_3 Register Field Descriptions
        12. 7.6.1.12 USB3.1_4 Register (Offset = 23h) [reset = 23h]
          1. Table 24. USB3.1_4 Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 USB 3.1 only (USB/DP Alternate Mode)
      2. 8.3.2 USB3.1 and 2 lanes of DisplayPort
      3. 8.3.3 DisplayPort Only
      4. 8.3.4 USB 3.1 only (USB/Custom Alternate Mode)
      5. 8.3.5 USB3.1 and 1 Lane of Custom Alt Mode
      6. 8.3.6 USB3.1 and 2 Lane of Custom Alt Mode
      7. 8.3.7 USB3.1 and 4 Lane of Custom Alt Mode
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

  1. RXP/N and TXP/N pairs should be routed with controlled 90-Ohm differential impedance (+/- 15%).
  2. Keep away from other high speed signals.
  3. Intra-pair routing should be kept to within 2 mils.
  4. Length matching should be near the location of mismatch.
  5. Each pair should be separated at least by 3 times the signal trace width.
  6. The use of bends in differential traces should be kept to a minimum. When bends are used, the number of left and right bends should be as equal as possible and the angle of the bend should be ≥ 135 degrees. This will minimize any length mismatch causes by the bends and therefore minimize the impact bends have on EMI.
  7. Route all differential pairs on the same of layer.
  8. The number of VIAS should be kept to a minimum. It is recommended to keep the VIAS count to 2 or less.
  9. Keep traces on layers adjacent to ground plane.
  10. Do NOT route differential pairs over any plane split.
  11. Adding Test points will cause impedance discontinuity; and therefore, negatively impacts signal performance. If test points are used, the test points should be placed in series and symmetrically. The test points must not be placed in a manner that causes a stub on the differential pair.