SLLSEV7E August   2016  – March 2023 TUSB546-DCI

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Characteristics
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
      1.      Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 USB 3.1
      2. 7.3.2 DisplayPort
      3. 7.3.3 4-Level Inputs
      4. 7.3.4 Receiver Linear Equalization
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Configuration in GPIO Mode
      2. 7.4.2 28
      3. 7.4.3 Device Configuration In I2C Mode
      4. 7.4.4 DisplayPort Mode
      5. 7.4.5 Linear EQ Configuration
      6. 7.4.6 USB3.1 Modes
      7. 7.4.7 Operation Timing – Power Up
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1 General Register (address = 0x0A) [reset = 00000001]
      2. 7.6.2 DisplayPort Control/Status Registers (address = 0x10) [reset = 00000000]
      3. 7.6.3 DisplayPort Control/Status Registers (address = 0x11) [reset = 00000000]
      4. 7.6.4 DisplayPort Control/Status Registers (address = 0x12) [reset = 00000000]
      5. 7.6.5 DisplayPort Control/Status Registers (address = 0x13) [reset = 00000000]
      6. 7.6.6 USB3.1 Control/Status Registers (address = 0x20) [reset = 00000000]
      7. 7.6.7 USB3.1 Control/Status Registers (address = 0x21) [reset = 00000000]
      8. 7.6.8 USB3.1 Control/Status Registers (address = 0x22) [reset = 00000100]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 USB 3.1 Only
      2. 8.3.2 USB 3.1 and 2 Lanes of DisplayPort
      3. 8.3.3 DisplayPort Only
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TUSB546-DCIUNIT
RNQ (WQFN)
40 PINS
RθJAJunction-to-ambient thermal resistance37.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance20.7°C/W
RθJBJunction-to-board thermal resistance9.5°C/W
ψJTJunction-to-top characterization parameter0.2°C/W
ψJBJunction-to-board characterization parameter9.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance2.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.